Display device

ABSTRACT

A display device includes a display panel including a light-emitting device to emit light; and an input sensor disposed on the display panel. The input sensor includes a first insulating layer disposed on the display panel; a first conductive layer disposed on the first insulating layer; a second insulating layer covering the first conductive layer; and a second conductive layer disposed on the second insulating layer. At least one of the first and second insulating layers includes a plurality of diffraction patterns arranged to diffract at least a portion of the light provided from the display panel.

CROSS REFERENCE TO RELATED APPLICATION

This application is a Continuation of U.S. patent application Ser. No.17/959,209, filed on Oct. 3, 2022, which is a Continuation of U.S.patent application Ser. No. 17/065,472, filed on Oct. 7, 2020, nowissued as U.S. Pat. No. 11,462,718, which claims priority from and thebenefit of Korean Patent Application No. 10-2019-0131827, filed on Oct.23, 2019 and Korean Patent Application No. 10-2020-0034290, filed onMar. 20, 2020, in the Korean Intellectual Property Office, each of whichis hereby incorporated by reference for all purposes as if fully setforth herein.

BACKGROUND Field

Exemplary implementations of the invention relate generally to displaydevices and, more specifically, to display devices having an improvedviewing angle.

Discussion of the Background

Electronic devices, such as smart phones, tablets, laptop computers, andsmart television sets, are being developed. The electronic deviceincludes a display device to provide information to a user. As amultimedia technology advances, there is an increasing demand fordisplay devices suitable for the multimedia environment. In order tomeet the demand, various kinds of display devices, such as liquidcrystal display (LCD) and organic light emitting display (OLED) devices,have been developed.

The organic light emitting diode device includes an organic lightemitting diode, which is configured to emit light. However, thelight-emitting characteristic of the organic light emitting diode ispoor in the lateral direction compared with the front side, which leadsto a reduction in the lateral viewing angle of the organic lightemitting display device, compared to the front viewing angle.

The above information disclosed in this Background section is only forunderstanding of the background of the inventive concepts, and,therefore, it may contain information that does not constitute priorart.

SUMMARY

Applicant discovered that the reduction in the lateral viewing angle oforganic light emitting display devices compared to a front viewing anglecan be improved by diffracting light in the organic light emittingdisplay devices.

Display devices constructed according to the principles and exemplaryimplementations of the invention have an improved lateral viewing angle,which may be achieved by providing diffraction patterns in an inputsensor of the display devices.

In display devices constructed according to the principles and someexemplary embodiments of the invention, light emitted from an organiclight emitting diode may be diffracted by diffraction patterns toimprove a color-difference issue that may occur when a viewing angle isincreased. Accordingly, the overall viewing angle characteristics of thedisplay device may be improved.

Additional features of the inventive concepts will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the inventive concepts.

According to one aspect of the invention, a display device includes adisplay panel including a light-emitting device to emit light; and aninput sensor disposed on the display panel, wherein the input sensorincludes: a first insulating layer disposed on the display panel; afirst conductive layer disposed on the first insulating layer; a secondinsulating layer covering the first conductive layer; and a secondconductive layer disposed on the second insulating layer, wherein atleast one of the first and second insulating layers includes a pluralityof diffraction patterns arranged to diffract at least a portion of thelight provided from the display panel.

The plurality of diffraction patterns may be disposed in the secondinsulating layer.

The plurality of diffraction patterns may be disposed in the firstinsulating layer.

The plurality of diffraction patterns may include: a plurality of firstdiffraction patterns disposed in the first insulating layer; and aplurality of second diffraction patterns disposed in the secondinsulating layer.

The first insulating layer may have a multi-layered structure includingat least two stacked sub-insulating layers.

The plurality of first diffraction patterns may include: a plurality offirst sub-diffraction patterns disposed in a first sub-insulating layerof the first insulating layer; and a plurality of second sub-diffractionpatterns disposed in a second sub-insulating layer of the firstinsulating layer and overlapping the plurality of first sub-diffractionpatterns, wherein the plurality of second diffraction patterns may bedisposed in the second insulating layer overlapping the plurality ofsecond sub-diffraction patterns.

The display panel further may include an encapsulation layer coveringthe light-emitting device, and the first insulating layer is directlydisposed on the encapsulation layer.

The encapsulation layer may include: a first encapsulation layercovering a plurality of pixels; a second encapsulation layer disposed onthe first encapsulation layer; and a third encapsulation layer disposedon the second encapsulation layer, wherein the first insulating layermay be disposed on the third encapsulation layer.

The first insulating layer may have a multi-layered structure includingat least two stacked sub-insulating layers, and the plurality ofdiffraction patterns may include: a plurality of first diffractionpatterns disposed in the at least two stacked sub-insulating layers; anda plurality of second diffraction patterns disposed in the secondinsulating layer.

The plurality of diffraction patterns may further include a plurality ofthird diffraction patterns disposed in the third encapsulation layeroverlapping the plurality of first diffraction patterns.

The plurality of diffraction patterns may include a plurality of holespenetrating at least one of the first and second insulating layers.

The plurality of holes may have one of generally circular, polygonal,elliptical, and elongated shapes.

The plurality of diffraction patterns may be columnar-shaped structuresdisposed in at least one of the first and second insulating layers.

The columnar-shaped structures may have one of generally circular,polygonal, elliptical, and elongated shapes.

The input sensor may include an input-sensing unit including aprotection layer disposed on the second insulating layer, and each ofthe first and second insulating layers has a refractive index differentfrom a refractive index of the protection layer.

The display panel may include a plurality of pixels, and each of theplurality of pixels may include: an emission region to emit light, thelight-emitting device being disposed in the emission region; and anon-emission region adjacent to the emission region.

The plurality of diffraction patterns may overlap at least the emissionregion.

The plurality of diffraction patterns may overlap the non-emissionregion.

The display panel may include a plurality of pixels including a firstpixel to emit red light, a second pixel to emit green light, and a thirdpixel to emit blue light, and the plurality of diffraction patternsoverlap at least one of the first to third pixels.

The plurality of diffraction patterns may overlap the first pixel.

The plurality of diffraction patterns may overlap the first and thirdpixels.

According to another aspect of the invention, a display device includes:a display panel including a plurality of pixels to display an image,each of the plurality of pixels including a light-emitting device toemit light; and an input sensor disposed on the display panel, whereinthe input sensor includes: a sensing electrode; and an insulating layerdisposed on or below the sensing electrode, the insulating layerincluding a plurality of diffraction patterns arranged to diffract atleast a portion of the light provided from the display panel, theplurality of diffraction patterns overlapping at least one of theplurality of pixels.

The sensing electrode may include a first sensing electrode and a secondsensing electrode intersecting each other, and each of the first andsecond sensing electrodes includes sensing portions and a connectingportion connecting adjacent ones of the sensing portions.

The insulating layer may include: a first insulating layer, on which theconnecting portion of the first sensing electrode is disposed; and asecond insulating layer, on which the sensing portions of the firstsensing electrode, the sensing portions of the second sensing electrode,and the connecting portion of the second sensing electrode are disposed,wherein the second insulating layer may cover the connecting portion ofthe first sensing electrode, and the connecting portion of the firstsensing electrode may be electrically connected to the sensing portionsof the first sensing electrode through a contact hole formed in thesecond insulating layer.

The plurality of diffraction patterns may be disposed in at least one ofthe first and second insulating layers.

The plurality of diffraction patterns may include a plurality of holespenetrating at least one of the first and second insulating layers.

The display device may further include a protection layer disposed onthe second insulating layer to cover the sensing portions of the firstsensing electrode, the sensing portions of the second sensing electrode,and the connecting portion of the second sensing electrode.

The insulating layer may further include a third insulating layerdisposed between the protection layer and the second insulating layer,and the plurality of diffraction patterns are disposed in the thirdinsulating layer.

The plurality of diffraction patterns may be disposed in the secondinsulating layer, and the insulating layer may further include a fourthinsulating layer disposed below the first insulating layer.

The plurality of diffraction patterns may be disposed in the secondinsulating layer, and the insulating layer may further include a fifthinsulating layer disposed between the first and second insulatinglayers.

The plurality of diffraction patterns may be disposed on the firstinsulating layer, and the second insulating layer may include adiffraction open portion overlapping the plurality of diffractionpatterns formed on the first insulating layer.

Each of the sensing portions of the first and second sensing electrodesmay include a mesh electrode having a mesh shape.

The plurality of diffraction patterns may not be overlapped with themesh electrode, when viewed in plan.

The plurality of pixels may include a first pixel to emit red light, asecond pixel to emit green light, and a third pixel to emit blue light,and the plurality of diffraction patterns overlap at least one of thefirst to third pixels.

The plurality of diffraction patterns may overlap the first pixel.

The plurality of diffraction patterns may overlap the first and thirdpixels.

The display panel further may include an encapsulation layer coveringthe plurality of pixels, and the input sensor includes an input-sensingunit directly disposed on the encapsulation layer.

According to another aspect of the invention, a display device includes:a display panel including a plurality of pixels to display an image,each of the plurality of pixels including a light-emitting device toemit light; and a diffraction pattern layer including a plurality ofdiffraction patterns arranged on the display panel to diffract at leasta portion of the light provided from the display panel, wherein theplurality of diffraction patterns overlap at least one of the pluralityof pixels.

The plurality of pixels may include a first pixel to emit red light, asecond pixel to emit green light, and a third pixel to emit blue light,and the plurality of diffraction patterns overlap at least one of thefirst to third pixels.

The plurality of diffraction patterns may overlap the first pixel.

The plurality of diffraction patterns may overlap the first and thirdpixels.

The display device may further include an input sensor disposed on thedisplay panel, wherein the diffraction pattern layer may be disposedbetween the display panel and the input sensor or is disposed on theinput sensor.

The display panel may further include an encapsulation layer coveringthe plurality of pixels, and the input sensor is directly disposed onthe encapsulation layer.

The input sensor may include an input-sensing unit including: a firstinsulating layer directly disposed on the encapsulation layer; a firstconductive layer disposed on the first insulating layer; a secondinsulating layer covering the first conductive layer; a secondconductive layer disposed on the second insulating layer; and aprotection layer covering the second conductive layer and the secondinsulating layer.

The diffraction pattern layer may be disposed on the protection layer.

The diffraction pattern layer may be disposed between the encapsulationlayer and the first insulating layer.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate exemplary embodiments of theinvention, and together with the description serve to explain theinventive concepts.

FIG. 1A is a perspective view of an exemplary embodiment of a displaydevice constructed according to the principles of the invention.

FIG. 1B is an exploded perspective view of the display device of FIG.1A.

FIG. 1C is a sectional view taken along a line I-I′ of FIG. 1B.

FIG. 2 is a plan view of a display panel of the display device of FIG.1B.

FIG. 3 is a plan view of an exemplary embodiment of an input-sensingunit of the display device of FIG. 1B.

FIG. 4A is an enlarged plan view of region ‘FF’ of FIG. 2 .

FIG. 4B is an enlarged plan view of the region ‘FF’ of FIG. 3 .

FIG. 5A is a sectional view taken along a line II-IF of FIG. 4Billustrating an exemplary embodiment of the display module of FIG. 1B.

FIG. 5B is a sectional view taken along a line III-III of FIG. 3illustrating the input-sensing unit of FIG. 3 .

FIG. 6A is an enlarged sectional view illustrating a portion ‘GG’ ofFIG. 5A.

FIG. 6B is a plan view of an exemplary embodiment of a second insulatinglayer of FIG. 5A.

FIGS. 7A to 7F are plan views of other exemplary embodiments of thesecond insulating layer of FIG. 5A.

FIGS. 8A and 8B are sectional views of other exemplary embodiments ofthe display module of FIG. 1B.

FIGS. 9A and 9B are sectional views of other exemplary embodiments ofthe display module of FIG. 1B.

FIG. 10 is a sectional view of another exemplary embodiment of thedisplay module of FIG. 1B.

FIGS. 11A and 11B are sectional views of other exemplary embodiments ofthe display module of FIG. 1B.

FIG. 12 is an enlarged plan view of the region ‘FF’ of FIG. 3illustrating another exemplary embodiment of the input-sensing unit ofFIG. 3 .

FIGS. 13A to 13E are sectional views taken along a line IV-IV′ of FIG.12 illustrating exemplary embodiments of the display module of FIG. 1B.

FIG. 14A is a graph showing brightness ratios of red, green, and bluelights versus viewing angle.

FIG. 14B is a graph showing correlated color temperature (CCT)characteristics versus viewing angle.

FIG. 14C is a graph showing minimum perceptible color difference (MPCD)characteristics versus viewing angle.

FIG. 15 is an enlarged plan view of the region ‘FF’ of FIG. 3illustrating another exemplary embodiment of the input-sensing unit ofFIG. 3 .

FIGS. 16A to 16C are sectional views taken along a line V-V′ of FIG. 15illustrating exemplary embodiments of the display module of FIG. 1B.

FIG. 17A is a graph showing correlated color temperature (CCT)characteristics versus viewing angle.

FIG. 17B is a graph showing minimum perceptible color difference (MPCD)characteristics versus viewing angle.

FIG. 18 is a plan view of another exemplary embodiment of theinput-sensing unit of the display device of FIG. 1B.

FIG. 19 is a sectional view of another exemplary embodiment of thedisplay module of FIG. 1B.

FIG. 20 is a sectional view of another exemplary embodiment of thedisplay module of FIG. 1B.

FIG. 21 is a sectional view of another exemplary embodiment of thedisplay module of FIG. 1B.

FIG. 22 is a sectional view of another exemplary embodiment of thedisplay module of FIG. 1B.

FIG. 23 is a sectional view of another exemplary embodiment of thedisplay module of FIG. 1B.

DETAILED DESCRIPTION

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments or implementations of theinvention. As used herein “embodiments” and “implementations” areinterchangeable words that are non-limiting examples of devices ormethods employing one or more of the inventive concepts disclosedherein. It is apparent, however, that various exemplary embodiments maybe practiced without these specific details or with one or moreequivalent arrangements. In other instances, well-known structures anddevices are shown in block diagram form in order to avoid unnecessarilyobscuring various exemplary embodiments. Further, various exemplaryembodiments may be different, but do not have to be exclusive. Forexample, specific shapes, configurations, and characteristics of anexemplary embodiment may be used or implemented in another exemplaryembodiment without departing from the inventive concepts.

Unless otherwise specified, the illustrated exemplary embodiments are tobe understood as providing exemplary features of varying detail of someways in which the inventive concepts may be implemented in practice.Therefore, unless otherwise specified, the features, components,modules, layers, films, panels, regions, and/or aspects, etc.(hereinafter individually or collectively referred to as “elements”), ofthe various embodiments may be otherwise combined, separated,interchanged, and/or rearranged without departing from the inventiveconcepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anexemplary embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order. Also, like reference numerals denote like elements.

When an element or a layer, is referred to as being “on,” “connectedto,” or “coupled to” another element or layer, it may be directly on,connected to, or coupled to the other element or layer or interveningelements or layers may be present. When, however, an element or layer isreferred to as being “directly on,” “directly connected to,” or“directly coupled to” another element or layer, there are no interveningelements or layers present. To this end, the term “connected” may referto physical, electrical, and/or fluid connection, with or withoutintervening elements. Further, the D1-axis, the D2-axis, and the D3-axisare not limited to three axes of a rectangular coordinate system, suchas the x, y, and z—axes, and may be interpreted in a broader sense. Forexample, the D1-axis, the D2-axis, and the D3-axis may be perpendicularto one another, or may represent different directions that are notperpendicular to one another. For the purposes of this disclosure, “atleast one of X, Y, and Z” and “at least one selected from the groupconsisting of X, Y, and Z” may be construed as X only, Y only, Z only,or any combination of two or more of X, Y, and Z, such as, for instance,XYZ, XYY, YZ, and ZZ. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one element's relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various exemplary embodiments are described herein with reference tosectional and/or exploded illustrations that are schematic illustrationsof idealized exemplary embodiments and/or intermediate structures. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should notnecessarily be construed as limited to the particular illustrated shapesof regions, but are to include deviations in shapes that result from,for instance, manufacturing. In this manner, regions illustrated in thedrawings may be schematic in nature and the shapes of these regions maynot reflect actual shapes of regions of a device and, as such, are notnecessarily intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1A is a perspective view of an exemplary embodiment of a displaydevice constructed according to the principles of the invention, FIG. 1Bis an exploded perspective view of the display device of FIG. 1A, andFIG. 1C is a sectional view taken along a line I-I′ of FIG. 1B.

Referring to FIGS. 1A to 1C, a display device DD may be an electronicdevice, which is selectively activated by an electrical signal appliedthereto. The display device DD may be implemented in various forms. Forexample, the display device DD may be used for various electronicdevices, such as smart watches, tablets, laptop computers, computers,and smart television sets.

The display device DD may include a display surface IS, which isparallel to each of a first direction DR1 and a second direction DR2 andis used to display an image IM in a third direction DR3. The displaysurface IS, on which the image IM is displayed, may correspond to afront surface of the display device DD. The image IM may be a videoimage or a still image. In the illustrated exemplary embodiment, a frontor top surface and a rear or

bottom surface of each element or member may be defined, based on adisplay direction (e.g., the third direction DR3) of the image IM. Thefront surface and the rear surface may be opposite to each other in thethird direction DR3, and a direction normal to each of the front andrear surfaces may be parallel to the third direction DR3.

The distance between the front and rear surfaces of the display deviceDD in the third direction DR3 may correspond to the thickness of thedisplay device DD in the third direction DR3. Directions indicated bythe first to third directions DR1, DR2, and DR3 may be relative concept,and in exemplary embodiments, they may be changed to indicate otherdirections.

The display device DD may sense an external input provided from theoutside. The external input may include various types of input signals,which are provided from the outside of the display device DD.

For example, the external input may be a touching-type input by a user'sbody or hand and a non-touching-type input, such as a reduction indistance to the display device DD or a hovering event near the displaydevice DD. In addition, the external input may be provided in variousforms, such as force, pressure, temperature, and light.

The front surface of the display device DD may include a transmissionregion TA and a bezel region BZA. The transmission region TA may be aregion, on which the image IM is displayed. The image IM displayed onthe transmission region TA may be provided to a user. In the illustratedexemplary embodiment, the transmission region TA has a generallyrectangular shape with rounded corners. However, exemplary embodimentsare not limited thereto, and for example, the transmission region TA mayhave various shapes.

The bezel region BZA may be adjacent to the transmission region TA. Thebezel region BZA may have a predetermined color. The bezel region BZAmay enclose the transmission region TA. Thus, the shape of thetransmission region TA may be substantially defined by the bezel regionBZA. However, exemplary embodiments are not limited thereto. Forexample, the bezel region BZA may be disposed near only one of sideregions of the transmission region TA or may be omitted. Furthermore,the display device DD may be implemented in various forms, and exemplaryembodiments are not limited to a specific example of the display deviceDD.

As shown in FIGS. 1B and 1C, the display device DD may include a windowWM, an external case EDC, and a display module DM. The display module DMmay include a display panel DP, an input sensor in the form of aninput-sensing unit ISP, and an anti-reflector in the form of ananti-reflection unit RPP.

The window WM may be formed of a transparent material, allowing an imagelight to be emitted to the outside. For example, the window WM may beformed of or include glass, sapphire, plastic, and the like. The windowWM may have a single-layered structure, as shown in FIG. 1A, butexemplary embodiments are not limited thereto; for example, the windowWM may include a plurality of layers. For example, the bezel region BZAof the display device DD may substantially be a region of the window WM,on which a material of a specific color is printed. In an exemplaryembodiment, the window WM may include a light-blocking pattern WBM,which is used to define the bezel region BZA. The light-blocking patternWBM may be a colored organic layer, which is formed by, for example, acoating method.

According to an exemplary embodiment, the display panel DP may be alight-emitting type display panel, but exemplary embodiments are notlimited to a specific type of the display panel DP. For example, thedisplay panel DP may be an organic light emitting display panel, aquantum dot light-emitting display panel, or other known type of displaypanel. An emission layer of the organic light emitting display panel maybe formed of or include an organic luminescent material. An emissionlayer of the quantum dot light emitting display panel may include aquantum dot, a quantum rod, or the like. For the descriptiveconvenience, the description that follows will refer to an example inwhich the display panel DP is the organic light emitting display panel.

The input-sensing unit ISP may be directly disposed on the display panelDP. In an exemplary embodiment, the input-sensing unit ISP may be formedon the display panel DP in a successive manner. For example, theinput-sensing unit ISP may be formed directly on the display panel DP,and in this case, any adhesive film may not be disposed between theinput-sensing unit ISP and the display panel DP.

The display panel DP may generate an image to be displayed to theoutside, and the input-sensing unit ISP may obtain information ofcoordinates of an external input (e.g., a touch event).

The anti-reflection unit RPP may reduce reflectance of an external lightthat is incident from an outer space to the window WM. In an exemplaryembodiment, the anti-reflection unit RPP may include a phase retarderand a polarizer. The phase retarder may be of a film type or a liquidcrystal coating type and may include a k/2 and/or k/4 phase retarder.The polarizer may also be of a film type or a liquid crystal coatingtype. The polarizer of the film type may include an elongated syntheticresin film, whereas the polarizer of the liquid crystal coating type mayinclude liquid crystals arranged in a specific orientation. The phaseretarder and the polarizer may be realized using a single polarizerfilm. The anti-reflection unit RPP may further include a protectionfilm, which is disposed on or below the polarizer film.

Referring to FIG. 1C, the anti-reflection unit RPP may be disposed onthe input-sensing unit ISP. In other words, the anti-reflection unit RPPmay be disposed between the input-sensing unit ISP and the window WM.The input-sensing unit ISP, the anti-reflection unit RPP, and the windowWM may be connected to each other by adhesive films. For example, afirst adhesive film AF1 may be disposed between the input-sensing unitISP and the anti-reflection unit RPP, and a second adhesive film AF2 maybe disposed between the anti-reflection unit RPP and the window WM.Accordingly, the anti-reflection unit RPP may be connected to theinput-sensing unit ISP by the first adhesive film AF1, and the window WMmay be connected to the anti-reflection unit RPP by the second adhesivefilm AF2. In an exemplary embodiment, each of the first and secondadhesive films AF1 and AF2 may include an optically clear adhesive (OCA)film. However, exemplary embodiments are not limited to the abovematerial of the first and second adhesive films AF1 and AF2, and atypical adhesive material or a typical gluing agent may be used for thefirst and second adhesive films AF1 and AF2. For example, the first andsecond adhesive films AF1 and AF2 may include an optically clear resin(OCR) film or a pressure sensitive adhesive (PSA) film.

Referring to FIG. 1B, the display module DM may display an image inresponse to electrical signals applied thereto and may receive andoutput information in an external input. An active region AA and aperipheral region NAA may be defined in the display module DM. Theactive region AA may be defined as a region, which is used to emit lightto generate the image provided from the display module DM.

The peripheral region NAA may be disposed adjacent to the active regionAA. For example, the peripheral region NAA may enclose the active regionAA. However, exemplary embodiments are not limited thereto, and theshape of the peripheral region NAA may be variously changed. In anexemplary embodiment, the active region AA of the display module DM maycorrespond to at least a portion of the transmission region TA.

The display module DM may further include a main circuit board MCB, aflexible circuit film FCB, and a driving chip DIC.

The main circuit board MCB may be coupled to the flexible circuit filmFCB and may be electrically connected to the display panel DP. The maincircuit board MCB may include a plurality of driving elements. Thedriving elements may include a circuit portion, which is used to drivethe display panel DP.

The flexible circuit film FCB may be coupled to the display panel DP toelectrically connect the display panel DP to the main circuit board MCB.The driving chip DIC may be mounted on the flexible circuit film FCB.

The driving chip DIC may include driving elements (e.g., a data drivingcircuit), which are used to drive pixels of the display panel DP.Although the display device DD is illustrated to have one flexiblecircuit film FCB, exemplary embodiments are not limited thereto. Forexample, a plurality of flexible films may be coupled to the displaypanel DP.

Furthermore, FIG. 1B illustrates an example, in which the driving chipDIC is mounted on the flexible circuit film FCB, but exemplaryembodiments are not limited thereto. For example, the driving chip DICmay be mounted directly on the display panel DP. In this case, a portionof the display panel DP mounted with the driving chip DIC may be bent toface a rear surface of the display module DM.

The input-sensing unit ISP may be electrically connected to the maincircuit board MCB via the flexible circuit film FCB. However, exemplaryembodiments are not limited thereto. For example, the display module DMmay further include an additional flexible circuit board, which is usedto electrically connect the input-sensing unit ISP to the main circuitboard MCB.

The display module DM may be contained in the external case EDC. Theexternal case EDC may be combined with the window WM to define an outerappearance of the display device DD. The external case EDC may absorbimpact exerted from the outside and may prevent a contaminant ormoisture from entering the display module DM, and thus, internalelements contained in the external case EDC may be protected from thecontaminant or the moisture. In an exemplary embodiment, the externalcase EDC may include a plurality of container members coupled to eachother.

In an exemplary embodiment, the display device DD may further include anelectronic module, which includes various functional modules configuredto operate the display module DM, a power supply module, which suppliesan electric power for various operations of the display device DD, abracket, which is connected to the display module DM and/or the externalcase EDC to divide an internal space of the display device DD, and thelike.

FIG. 2 is a plan view of a display panel of the display device of FIG.1B, and FIG. 3 is a plan view of an exemplary embodiment of aninput-sensing unit of the display device of FIG. 1B.

Referring to FIGS. 2 and 3 , the display panel DP may include a drivingcircuit GDC, a plurality of signal lines SGL, and a plurality of pixelsPX. The display panel DP may further include a pad portion PLD disposedin the peripheral region NAA. The pad portion PLD may include pixel padsD-PD connected to a corresponding one of the signal lines SGL.

The pixels PX may be disposed in the active region AA. Each of thepixels PX may include an organic light emitting diode OLED (e.g., seeFIG. 5A) and a pixel driving circuit connected to the organic lightemitting diode OLED. The driving circuit GDC, the signal lines SGL, thepad portion PLD, and the pixel driving circuit may be included in adisplay circuit layer DP-CL shown in FIG. 5A.

The driving circuit GDC may include a gate driving circuit. The gatedriving circuit may generate a plurality of gate signals and maysequentially output the gate signals to a plurality of gate lines GL,which will be described below. The gate driving circuit may furtheroutput another control signal to the pixel driving circuit.

The signal lines SGL may include gate lines GL, data lines DL, a powerline PWL, and a control signal line CSL. One of the gate lines GL may beconnected to corresponding ones of the pixels PX, and one of the datalines DL may be connected to corresponding ones of the pixels PX. Thepower line PWL may be connected to the pixels PX. The control signalline CSL may provide control signals to the gate driving circuit. Thesignal lines SGL may be overlapped with the active region AA and theperipheral region NAA.

The pad portion PLD may be a portion, to which the flexible circuit filmFCB (e.g., see FIG. 1B) is connected, and may include the pixel padsD-PD, which are used to connect the flexible circuit film FCB to thedisplay panel DP, and input pads I-PD, which are used to connect theflexible circuit film FCB to the input-sensing unit ISP. The pixel padsD-PD and the input pads I-PD may be provided by exposing some ofinterconnection lines, which are disposed in the display circuit layerDP-CL, from an insulating layer in the display circuit layer DP-CL shownin FIG. 5A.

The pixel pads D-PD may be connected to corresponding ones of the pixelsPX through the signal lines SGL. In addition, the driving circuit GDCmay be connected to one of the pixel pads D-PD.

Referring to FIG. 3 , the input-sensing unit ISP may include firstsensing electrodes IE1-1 to IE1-5, first signal lines SL1-1 to SL1-5connected to the first sensing electrodes IE1-1 to IE1-5, second sensingelectrodes 1E2-1 to 1E2-4, and second signal lines SL2-1 to SL2-4connected to the second sensing electrodes 1E2-1 to 1E2-4. In anexemplary embodiment, the input-sensing unit ISP may include thirdsignal lines connected to the second sensing electrodes 1E2-1 to 1E2-4.In this case, the second signal lines SL2-1 to SL2-4 may be connected toends of the second sensing electrodes 1E2-1 to 1E2-4, and the thirdsignal lines may be connected to opposite ends of the second sensingelectrodes 1E2-1 to 1E2-4.

The first sensing electrodes IE1-1 to IE1-5 may intersect the secondsensing electrodes 1E2-1 to 1E2-4. The first sensing electrodes IE1-1 toIE1-5 may be arranged in the first direction DR1 and may extend in thesecond direction DR2.

Each of the first sensing electrodes IE1-1 to IE1-5 may include firstsensing portions SP1 and first connecting portions CP1, which aredisposed in the active region AA. Each of the second sensing electrodes1E2-1 to 1E2-4 may include second sensing portions SP2 and secondconnecting portions CP2, which are disposed in the active region AA. Twoof the first sensing portions SP1, which are located at opposite ends ofthe first sensing electrode, may have a small area or size (e.g., halfarea), compared with a central one of the first sensing portions SP1.Two of the second sensing portions SP2, which are located at oppositeends of the second sensing electrode, may have a small area or size(e.g., half area), compared with a central one of the second sensingportions SP2.

FIG. 3 illustrates the first sensing electrodes IE1-1 to IE1-5 and thesecond sensing electrodes 1E2-1 to 1E2-4, but exemplary embodiments arenot limited to the details of the first sensing electrodes IE1-1 toIE1-5 and the second sensing electrodes 1E2-1 to 1E2-4. For example, inan exemplary embodiment, the first sensing electrodes IE1-1 to IE1-5 andthe second sensing electrodes 1E2-1 to 1E2-4 may have a shape (e.g., abar shape), in which the sensing portion is not differentiated from theconnecting portion. The first sensing portions SP1 and the secondsensing portions SP2 are illustrated to have a diamond-like shape, butexemplary embodiments are not limited thereto. For example, each of thefirst and second sensing portions SP1 and SP2 may be provided to haveone of other generally polygonal and other shapes.

In each of the first sensing electrodes IE1-1 to IE1-5, the firstsensing portions SP1 may be arranged in the second direction DR2, and ineach of the second sensing electrodes 1E2-1 to 1E2-4, the second sensingportions SP2 may be arranged in the first direction DR1. Each of thefirst connecting portions CP1 may connect adjacent ones of the firstsensing portions SP1, and each of the second connecting portions CP2 mayconnect adjacent ones of the second sensing portions SP2.

The first sensing electrodes IE1-1 to IE1-5 and the second sensingelectrodes IE2-1 to 1E2-4 may have a mesh shape. In this case, it may bepossible to reduce the parasitic capacitance between the sensingelectrodes and the electrodes of the display panel DP (e.g., see FIG. 2). Furthermore, as will be described below, the first sensing electrodesIE1-1 to IE1-5 and the second sensing electrodes 1E2-1 to 1E2-4 may notbe overlapped with emission regions PXA-R, PXA-G, and PXA-B (e.g., seeFIG. 4A), and in this case, it may be possible to prevent the firstsensing electrodes IE1-1 to IE1-5 and the second sensing electrodes1E2-1 to 1E2-4 from being recognized or observed by a user.

The first sensing electrodes IE1-1 to IE1-5 and the second sensingelectrodes IE2-1 to 1E2-4 may be formed in a mesh shape of or includesilver, aluminum, copper, chromium, nickel, titanium, and the like,which can be formed by a low temperature process, but exemplaryembodiments are not limited thereto. It may be possible to prevent theorganic light emitting diodes OLED (e.g., see FIG. 5A) from beingdamaged, even when the input-sensing unit ISP is formed through asuccessive process.

The first signal lines SL1-1 to SL1-5 may be connected to one-side endsof the first sensing electrodes IE1-1 to IE1-5, respectively. In anexemplary embodiment, the input-sensing unit ISP may further includesignal lines, which are connected to opposite ends of the first sensingelectrodes IE1-1 to IE1-5.

The first signal lines SL1-1 to SL1-5 and the second signal lines SL2-1to SL2-4 may be disposed in the peripheral region NAA. The input-sensingunit ISP may include the input pads I-PD, which are extended from endsof the first signal lines SL1-1 to SL1-5 and the second signal linesSL2-1 to SL2-4 and are disposed in the peripheral region NAA.

FIG. 4A is an enlarged plan view of region ‘FF’ of FIG. 2 , and FIG. 4Bis an enlarged plan view of the region ‘FF’ of FIG. 3 .

Referring to FIG. 4A, the display panel DP may include a plurality ofpixels. In an exemplary embodiment, the plurality of pixels may includea plurality of first pixels PX-R, a plurality of second pixels PX-G, anda plurality of third pixels PX-B, which have different sizes. In otherwords, the second pixels PX-G may have a smaller size than the first andthird pixels PX-R and PX-B, and the first pixels PX-R may have a smallersize than the third pixels PX-B. In an exemplary embodiment, the firstpixels PX-R may be pixels emit red light, the second pixels PX-G may bepixels emit green light, and the third pixels PX-B may be pixels emitblue light.

The first pixels PX-R may be arranged in the first and second directionsDR1 and DR2. The first and third pixels PX-R and PX-B may be alternatelyrepeated and may be arranged in the first and second directions DR1 andDR2. A non-pixel region NPA may be provided between the first to thirdpixels PX-R, PX-G, and PX-B.

FIG. 4A illustrates an example of the arrangement of the first to thirdpixels PX-R, PX-G, and PX-B, but exemplary embodiments are not limitedthereto. For example, in an exemplary embodiment, the first pixel PX-R,the second pixel PX-G, and the third pixel PX-B may be alternatelyarranged in the second direction DR2. In addition, each of the first tothird pixels PX-R, PX-G, and PX-B is illustrated to have a generallyrectangular shape, but exemplary embodiments are not limited thereto.For example, each of the first to third pixels PX-R, PX-G, and PX-B maybe provided to have various shapes (e.g., polygonal, circular, andelliptical shapes). In an exemplary embodiment, the first to thirdpixels PX-R, PX-G, and PX-B may have different shapes. For example, thesecond pixel PX-G may have a generally hexagonal or octagonal shape, andthe first and third pixels PX-R and PX-B may have a generallyrectangular or square shape.

In FIG. 4A, the second pixels PX-G are illustrated to have a smallersize than the first pixels PX-R and the third pixels PX-B, but exemplaryembodiments are not limited thereto. For example, in an exemplaryembodiment, the first to third pixels PX-R, PX-G, and PX-B may have thesame size.

Each of the first pixels PX-R may include a first emission region PXA-R,through which light is emitted, and a first non-emission region NPXA-R,which is formed around or near the first emission region PXA-R. Each ofthe second pixel PX-G may include a second emission region PXA-G,through which light is emitted, and a second non-emission region NPXA-G,which is formed around or near the second emission region PXA-G. Each ofthe third pixel PX-B may include a third emission region PXA-B, throughwhich light is emitted, and a third non-emission region NPXA-B, which isformed around or near the third emission region PXA-B. The first tothird non-emission regions NPXA-R, NPXA-G, and NPXA-B may be defined asregions through which light is not emitted.

Referring to FIGS. 4A and 4B, the first sensing portions SP1 of theinput-sensing unit ISP may have a mesh shape. Each of the first sensingportions SP1 may include a mesh electrode MSE, which is patterned tohave a mesh shape. The first sensing portions SP1 may be disposed tocorrespond to the non-pixel region NPA, and in this case, it may bepossible to increase opening ratios of the first to third pixels PX-R,PX-G, and PX-B and to reduce parasitic capacitance. The mesh electrodeMSE may be partially overlapped with the first to third non-emissionregions NPXA-R, NPXA-G, and NPXA-B.

The input-sensing unit ISP may include one or more diffraction patterns.As used herein, “diffraction pattern” means a diffraction element, whichmay be any type of discontinuity, such as a hole, projection, reducedthickness portion, or other structure that is capable of diffractinglight, and is arranged in a regular repeating sequence or an irregularrandom sequence in a layer or member. For example, the diffractionpatterns DFP may be arranged to be regularly spaced apart from eachother with a substantially constant pitch and are used to diffract atleast a portion of the light passing through the input-sensing unit ISP.A plurality of the diffraction patterns DFP may be overlapped with eachof the emission regions PXA-R, PXA-G, and PXA-B of the pixels PX-R,PX-G, and PX-B. In an exemplary embodiment, a plurality of thediffraction patterns DFP may be overlapped with each of the emission andnon-emission regions PXA-R, PXA-G, PXA-B, NPXA-R, NPXA-G, and NPXA-B ofthe pixels PX-R, PX-G, and PX-B.

The diffraction patterns DFP may not be overlapped with the non-pixelregion NPA. In other words, the diffraction patterns DFP may be providedin such a way that they are not overlapped with the mesh electrode MSE.

In an exemplary embodiment, each of the diffraction patterns DFP mayhave a generally circular shape, when viewed in plan. However, exemplaryembodiments are not limited to the shape of the diffraction patternsDFP. For example, the diffraction patterns DFP may be provided to havevarious shapes (e.g., generally polygonal, elliptical, and elongatedshapes).

FIG. 5A is a sectional view taken along a line II-IF of FIG. 4Billustrating an exemplary embodiment of the display module of FIG. 1B,and FIG. 5B is a sectional view taken along a line III-III′ of FIG. 3illustrating the input-sensing unit of FIG. 3 . FIG. 6A is an enlargedsectional view illustrating a portion ‘GG’ of FIG. 5A, and FIG. 6B is aplan view of an exemplary embodiment of a second insulating layer ofFIG. 5A.

Referring to FIG. 5A, the display panel DP of the display module DM mayinclude a base layer BL and a display circuit layer DP-CL disposed onthe base layer BL, a display element layer DP-OLED disposed on thedisplay circuit layer DP-CL, and an encapsulation layer TFE disposed onthe display element layer DP-OLED. For example, the display panel DP mayfurther include functional layers, such as an anti-reflection layer anda refractive index control layer.

The base layer BL may include a synthetic resin layer. The syntheticresin layer may be formed on a working substrate, which is used tofabricate the display panel DP. Thereafter, a conductive layer, aninsulating layer, and the like may be formed on the synthetic resinlayer. When the working substrate is removed, the synthetic resin layermay be used as the base layer BL. The synthetic resin layer may be apolyimide-based resin layer, but exemplary embodiments are not limitedto a specific material. In addition, the base layer BL may include aglass substrate, a metal substrate, or an organic/inorganic compositesubstrate.

The display circuit layer DP-CL may include at least one insulatinglayer and a circuit element. Hereinafter, the insulating layer in thedisplay circuit layer DP-CL will be referred to as an intermediateinsulating layer. The intermediate insulating layer may include at leastone inorganic intermediate layer and at least one organic intermediatelayer. The circuit element may include signal lines, a pixel drivingcircuit, or the like. The formation of the display circuit layer DP-CLmay include the step of forming an insulating layer, a semiconductorlayer, and a conductive layer by a coating process or a depositionprocess and the step of patterning the insulating layer, thesemiconductor layer, and the conductive layer by a photolithographyand/or etching process.

The display element layer DP-OLED may include a pixel definition layerPDL and a plurality of organic light emitting diodes OLED. The pixeldefinition layer PDL may be formed of or include an organic material.Each of the plurality of organic light emitting diodes OLED includes afirst electrode AE, an emission layer EML, and a second electrode CE.The first electrode AE may be disposed on the display circuit layerDP-CL. The pixel definition layer PDL may be formed on the firstelectrode AE. An opening OP may be defined in the pixel definition layerPDL. The opening OP of the pixel definition layer PDL may expose atleast a portion of the first electrode AE. In an exemplary embodiment,the pixel definition layer PDL may be omitted.

As shown in FIGS. 4A and 5A, the display panel DP may include theemission regions PXA-R, PXA-G, and PXA-B and non-emission regionsNPXA-R, NPXA-G, and NPXA-B, which are provided near the emission regionsPXA-R, PXA-G, and PXA-B. Each of the non-emission regions NPXA-R,NPXA-G, and NPXA-B may enclose a corresponding one of the emissionregions PXA-R, PXA-G, and PXA-B. In the illustrated exemplaryembodiment, each of the emission regions PXA-R, PXA-G, and PXA-B may bedefined to correspond to a portion of the first electrode AE exposed bythe opening OP. The non-pixel region NPA may be defined between thenon-emission regions NPXA-R, NPXA-G, and NPXA-B. The first electrode AEmay be separately formed in each of the pixels PX-R, PX-G, and PX-B.

The emission layer EML emitting light may be disposed on the firstelectrode AE. The emission layer EML may be provided on (in) a regioncorresponding to the opening OP. In other words, the emission layer EMLmay include a plurality of patterns that are separately and respectivelyformed in the pixels PX-R, PX-G, and PX-B. The emission layer EML may beformed of or include at least one of organic and/or inorganic materials.The emission layer EML may be configured to generate a specific colorlight. For example, the emission layer EML may generate light of red,green, or blue.

In the illustrated exemplary embodiment, the emission layer EML isillustrated to have a patterned structure, but exemplary embodiments arenot limited thereto. For example, the emission layer EML may be providedto have a continuous structure spanning a plurality of the emissionregions PXA-R, PXA-G, and PXA-B. Here, the emission layer EML maygenerate white-color light. Also, the emission layer EML may have amulti-layered structure called as ‘tandem’.

As shown in FIG. 6A, a hole control layer HCL may be disposed betweenthe emission layer EML and the first electrode AE. For example, the holecontrol layer HCL may be disposed in all of the emission regions PXA-R,PXA-G, and PXA-B, the non-emission regions NPXA-R, NPXA-G, and NPXA-B,and the non-pixel region NPA.

The second electrode CE may be disposed on the emission layer EML. Thesecond electrode CE may be disposed in all of the emission regionsPXA-R, PXA-G, and PXA-B, the non-emission regions NPXA-R, NPXA-G, andNPXA-B, and the non-pixel region NPA.

As shown in FIG. 6A, an electron control layer ECL may be furtherdisposed between the emission layer EML and the second electrode CE. Forexample, the electron control layer ECL may be disposed in all of theemission regions PXA-R, PXA-G, and PXA-B, the non-emission regionsNPXA-R, NPXA-G, and NPXA-B, and the non-pixel region NPA.

Referring to FIGS. 5A and 6A, the encapsulation layer TFE may bedisposed on the second electrode CE. The encapsulation layer TFE mayhermetically seal the display element layer DP-OLED. The encapsulationlayer TFE may include at least one insulating layer. In an exemplaryembodiment, the encapsulation layer TFE may include at least oneinorganic layer (hereinafter, a first inorganic encapsulation layerT-IL1). In an exemplary embodiment, the encapsulation layer TFE mayfurther include at least one organic layer (hereinafter, an organicencapsulation layer T-OL) and at least one inorganic layer (hereinafter,a second inorganic encapsulation layer T-IL2). The organic encapsulationlayer T-OL may be disposed between the first and second inorganicencapsulation layers T-IL1 and T-IL2.

The first and second inorganic encapsulation layers T-IL1 and T-IL2 mayprotect the display element layer DP-OLED from moisture or oxygen, andthe organic encapsulation layer T-OL may protect the display elementlayer DP-OLED from a contamination material such as dust particles. Thefirst and second inorganic encapsulation layers T-IL1 and T-IL2 mayinclude a silicon nitride layer, a silicon oxynitride layer, a siliconoxide layer, a titanium oxide layer, or an aluminum oxide layer, butexemplary embodiments are not limited thereto. The organic encapsulationlayer T-OL may be formed of or include an acrylic organic layer, butexemplary embodiments are not limited thereto.

The input-sensing unit ISP may include a first insulating layer Ill, afirst conductive layer disposed thereon, a second insulating layer IL2covering the first conductive layer, and a second conductive layerdisposed on the second insulating layer IL2. The first insulating layerIL1 may be formed of or include an inorganic material and may include,for example, a silicon nitride layer. The second inorganic encapsulationlayer T-IL2, which is the topmost layer of the encapsulation layer TFE,may also be formed of or include a silicon nitride layer, which isformed under a deposition condition different from that for the firstinsulating layer IL1.

Referring to FIGS. 3, 4B, 5A, and 5B, the first conductive layer may bedisposed on the first insulating layer IL1. The first conductive layermay include the first connecting portion CP1. The second conductivelayer may be disposed on the second insulating layer IL2. The secondconductive layer may include the first sensing portion SP1, the secondsensing portion SP2, and the second connecting portion CP2.

The second insulating layer IL2 may be disposed between the firstconductive layer and the second conductive layer. The second insulatinglayer IL2 may separate the first conductive layer from the secondconductive layer, when viewed in cross section. First and second contactholes CNT1 and CNT2 may be provided in the second insulating layer IL2to partially expose the first connecting portion CP1. The firstconnecting portion CP1 may be coupled to a pair of the first sensingportions SP1, which are adjacent to each other, through the first andsecond contact holes CNT1 and CNT2. The second connecting portion CP2may be formed to pass through a separation space between the adjacentpair of the first sensing portions SP1. The second connecting portionCP2 may be electrically connected with the adjacent pair of the secondsensing portions SP2.

FIG. 5B illustrates a structure, in which the first conductive layerincludes the first connecting portion CP1 and the second conductivelayer includes the first sensing portion SP1, the second sensing portionSP2, and the second connecting portion CP2, but exemplary embodimentsare not limited thereto. For example, the first conductive layer mayinclude the second connecting portion CP2, and the second conductivelayer may include the first sensing portion SP1, the second sensingportion SP2, and the first connecting portion CP1. In an exemplaryembodiment, the first conductive layer may include the first sensingportion SP1, the second sensing portion SP2, and the first connectingportion CP1, and the second conductive layer may include the secondconnecting portion CP2.

The second insulating layer IL2 may be formed of or include an inorganicmaterial. For example, the second insulating layer IL2 may include asilicon nitride layer. In an exemplary embodiment, the second insulatinglayer IL2 may be thicker than the first insulating layer IL1.

The diffraction patterns DFP may be formed in at least one of the firstand second insulating layers IL1 and IL2. FIG. 5A illustrates thediffraction patterns DFP formed in the second insulating layer IL2, butexemplary embodiments are not limited thereto.

The diffraction patterns DFP may be arranged at a substantially constantpitch to diffract at least a portion of light emitted from the emissionlayer EML. For example, the diffraction patterns DFP may diffract atleast a portion of light incident into the input-sensing unit ISP. Eachof the diffraction patterns DFP may be a hole penetrating the secondinsulating layer IL2. For example, the second insulating layer IL2 mayinclude a plurality of holes. The plurality of holes are formed topenetrate the second insulating layer IL2 in the third direction DR3 andare defined as the diffraction patterns DFP. The first insulating layerIL1 may be partially exposed by the diffraction patterns DFP.

The process of forming the holes DFP in the second insulating layer IL2may be performed concurrently with the process of forming the first andsecond contact holes CNT1 and CNT2 in the second insulating layer IL2.In other words, the holes DFP and the first and second contact holesCNT1 and CNT2 may be simultaneously formed by the same process. Thus, anadditional patterning process to form the diffraction patterns DFP maybe omitted, and this may make it possible to reduce the number of masksrequired to fabricate a display device, and the overall process time.

The diffraction patterns DFP may be overlapped with the emission regionsPXA-R, PXA-G, and PXA-B. The diffraction patterns DFP may be partiallyoverlapped with the non-emission regions NPXA-R, NPXA-G, and NPXA-B.

The diffraction patterns DFP may not be overlapped with the non-pixelregion NPA. The first and second conductive layers SP1, SP2, CP1, andCP2 may be disposed to correspond to the non-pixel region NPA. Thus, thediffraction patterns DFP may be provided in such a way that they are notoverlapped with the first and second conductive layers SP1, SP2, CP1,and CP2.

The input-sensing unit ISP may further include a protection layer PL.The protection layer PL may cover the second insulating layer IL2 andthe second conductive layers SP1, SP2, and CP2. In addition, theprotection layer PL may cover the first insulating layer IL1 exposed bythe diffraction patterns DFP. For example, the protection layer PL maybe formed to fill the holes DFP.

The protection layer PL may be formed of or include an organic material.For example, the protection layer PL may be formed of or include anacrylic resin. The protection layer PL may be thicker than the first andsecond insulating layers IL1 and IL2. In addition, the protection layerPL may have a refractive index different from that of the first andsecond insulating layers IL1 and IL2. For example, the protection layerPL may have a refractive index of about 1.6, and the first and secondinsulating layers IL1 and IL2 may have a refractive index of about 1.9.

Referring to FIG. 6A, the organic light emitting diode OLED may generatefirst lights L1a, L1b, and L1c. The first lights L1a, L1b, and L1cemitted from the organic light emitting diode OLED may pass through theencapsulation layer TFE and may be incident into the input-sensing unitISP. The first lights L1a, L1b, and L1c emitted from the organic lightemitting diode OLED may include a front light L1a, which propagates inan upward direction (e.g., in the third direction DR3 substantiallyperpendicular to the display surface IS of FIG. 1A), and first andsecond lateral lights L1b and L1c, which propagate in directionsdifferent from the front light L1a. For illustrative convenience, FIG.6A illustrates only some of the lateral lights L1b and L1c (e.g., thefirst and second lateral lights L1b and L1c propagating in directionsinclined at a first angle θ1 to the front light L1a).

The first lights L1a, L1b, and L1c, which are emitted from the organiclight emitting diode OLED, may be diffracted by the diffraction patternsDFP of the input-sensing unit ISP to form second lights L2a, L2b, andL2c. The diffraction of the first lights L1a, L1b, and L1c may be causedby not only the diffraction patterns DFP and but also by the differencein refractive index between the second insulating layer IL2 and theprotection layer PL filling the diffraction patterns DFP. For example,the diffraction effect by the diffraction patterns DFP may occur moredistinctly when there is a difference in refractive index between theprotection layer PL and the second insulating layer IL2 than when thereis no such difference.

The second lights L2a, L2b, and L2c may include a first diffractionlight L2a, which is produced by the diffraction of the front light L1a,and second and third diffraction lights L2b and L2c, which are producedby the diffraction of the first and second lateral lights L1b and L1c.The first diffraction light L2a may include a plurality of lights, oneof which propagates in the same direction as the front light L1a andothers of which propagate in different directions from the front lightL1a. In other words, the front light L1a may be emitted in lateraldirections as well as a front direction. Furthermore, the seconddiffraction light L2b may include a plurality of lights, one of whichpropagates in the same direction as the first lateral light L1b andothers of which propagate in different directions from the first laterallight L1b, and the third diffraction light L2c may include a pluralityof lights, one of which propagates in the same direction as the secondlateral light L1c and others of which propagate in different directionsfrom the second lateral light L1c. Thus, the first and second laterallights L1b and L1c may be emitted in the front direction as well as thelateral directions.

Since, as described above, the first lights L1a, L1b, and L1c emittedfrom the organic light emitting diode OLED are diffracted by thediffraction patterns DFP and propagate in various directions (e.g., thefront and lateral directions), a difference between colors in front andlateral directions may be reduced, and this may make it possible toimprove an overall viewing angle characteristic of the display deviceDD.

Referring to FIGS. 6A and 6B, the diffraction patterns DFP may bearranged at a specific or substantially constant pitch (hereinafter, anarrangement pitch). The diffraction patterns DFP may be arranged at afirst arrangement pitch a1 in the first direction DR1 and may bearranged at a second arrangement pitch a2 in the second direction DR2.As shown in FIG. 6B, the first arrangement pitch a1 and the secondarrangement pitch a2 may be equal to each other, but exemplaryembodiments are not limited thereto. In other words, the firstarrangement pitch a1 and the second arrangement pitch a2 may have valuesdifferent from each other.

Each of the diffraction patterns DFP may have a substantially constantwidth (i.e., diameter) b1. In an exemplary embodiment, the width b1 ofeach of the diffraction patterns DFP may be about 1 μm. The arrangementpitches a1 and a2 of the diffraction patterns DFP may be smaller thanthe width of a corresponding one of the emission regions PXA-R, PXA-G,and PXA-B.

As shown in FIG. 6B, the diffraction patterns DFP may have a generallycircular shape, when viewed in plan. In addition, the diffractionpatterns DFP may be arranged in a matrix shape. However, exemplaryembodiments are not limited to any specific shape or structure of thediffraction patterns DFP. For example, the diffraction patterns DFP mayhave one of generally elliptical, polygonal, and elongated shapes.

FIGS. 7A to 7F are plan views of other exemplary embodiments of thesecond insulating layer of FIG. 5A.

Referring to FIGS. 7A and 7B, each of diffraction patterns DFP1 and DFP2may be provided to have a hole-shaped structure penetrating the secondinsulating layer IL2. As shown in FIG. 7A, the diffraction patterns DFP1may have a generally tetragonal or rectangular hole shape. Thediffraction patterns DFP1 may be arranged in a matrix shape.

Alternatively, as shown in FIG. 7B, the diffraction patterns DFP2 mayhave an elongated shape elongated in a specific direction. Exemplaryembodiments are not limited to a specific elongation direction of thediffraction patterns DFP2. For example, the diffraction patterns DFP2may extend in the first and second directions DR1 and DR2 or in adirection that is inclined at an angle to the first and seconddirections DR1 and DR2.

Referring to FIG. 7C, diffraction patterns DFP_O and DFP_E may includeodd diffraction patterns DFP_O in odd-numbered rows and even diffractionpatterns DFP_E in even-numbered rows. The odd diffraction patterns DFP_Omay be arranged at a third arrangement pitch a3 in a row direction andmay be arranged at a fourth arrangement pitch a4 in a column direction.The even diffraction patterns DFP_E may be arranged at a fiftharrangement pitch a5 in the row direction and may be arranged at a sixtharrangement pitch a6 in the column direction. The number of the odddiffraction patterns DFP_O may be different from the number of the evendiffraction patterns DFP_E. In an exemplary embodiment, the thirdarrangement pitch a3 may have a value that is equal to or different fromthe fifth arrangement pitch a5, and the fourth arrangement pitch a4 mayhave a value that is equal to or different from the sixth arrangementpitch a6.

The odd diffraction patterns DFP_O and the even diffraction patternsDFP_E adjacent thereto may be spaced apart from each other by a firstdistance d1 in the row direction. Here, the third arrangement pitch a3or the fifth arrangement pitch a5 may be two times of the first distanced1. The odd diffraction patterns DFP_O and the even diffraction patternsDFP_E adjacent thereto may be spaced apart from each other by a seconddistance d2 in the column direction. Here, the fourth arrangement pitcha4 or the sixth arrangement pitch a6 may be two times of the seconddistance d2.

Referring to FIGS. 7D and 7E, diffraction patterns DFP3 and DFP4 mayhave a columnar shape, wherein the columnar shape may have one ofgenerally circular, polygonal, elliptical, and elongated shapes. In anexemplary embodiment, the diffraction patterns DFP3 and DFP4 may beisland-shaped patterns, which are spaced apart from each other. Adiffraction open portion D-OP, which has a size corresponding to anemission region of each pixel, may be provided in the second insulatinglayer IL2, and the diffraction patterns DFP3 or DFP4 may be disposed inthe diffraction open portion D-OP.

As shown in FIG. 7D, the diffraction patterns DFP3 may have a generallycircular columnar shape. The diffraction patterns DFP3 may be arrangedin a matrix shape.

As shown in FIG. 7E, the diffraction patterns DFP4 may have a polygonalcolumnar shape (e.g., a generally tetragonal, pentagonal, or hexagonalcolumnar shape). In addition, the diffraction patterns DFP4 may beelongated columnar patterns that are elongated in a specific direction.

Referring to FIG. 7F, diffraction patterns DFP3_O and DFP3_E may includeodd diffraction patterns DFP3_O in odd-numbered rows and evendiffraction patterns DFP3_E in even-numbered rows. The odd diffractionpatterns DFP3_O may have the same shape as the even diffraction patternsDFP3_E. For example, the odd diffraction patterns DFP3_O and the evendiffraction patterns DFP3_E may have a circular columnar shape.

The odd diffraction patterns DFP3_O may be arranged at the thirdarrangement pitch a3 in a row direction and may be arranged at thefourth arrangement pitch a4 in a column direction. The even diffractionpatterns DFP3_E may be arranged at the fifth arrangement pitch a5 in therow direction and may be arranged at the sixth arrangement pitch a6 inthe column direction. The number of the odd diffraction patterns DFP3_Oin the odd-numbered row may be different from the number of the evendiffraction patterns DFP3_E in the even-numbered row. In an exemplaryembodiment, the third arrangement pitch a3 may have a value that isequal to or different from the fifth arrangement pitch a5, and thefourth arrangement pitch a4 may have a value that is equal to ordifferent from the sixth arrangement pitch a6.

The odd diffraction patterns DFP3_O and the even diffraction patternsDFP3_E adjacent thereto may be spaced apart from each other by a firstdistance d1 in the row direction. Here, the third arrangement pitch a3and the fifth arrangement pitch a5 may be two times the first distanced1. The odd diffraction patterns DFP3_O and the even diffractionpatterns DFP3_E adjacent thereto may be spaced apart from each other bya second distance d2 in the column direction. Here, the fourtharrangement pitch a4 and the sixth arrangement pitch a6 may be two timesof the second distance d2.

FIGS. 8A and 8B are sectional views of other exemplary embodiments ofthe display module of FIG. 1B.

Referring to FIGS. 3, 4B, and 8A, the input-sensing unit ISP of thedisplay module DM may include the first insulating layer IL1, the firstand second conductive layers SP1, SP2, CP1, and CP2, the secondinsulating layer IL2, and the protection layer PL.

The diffraction patterns DFP may be provided in the first and secondinsulating layers IL1 and IL2. The diffraction patterns DFP in thedisplay module DM of FIG. 8A may include a plurality of firstdiffraction patterns DFP1-1, which are formed in the first insulatinglayer IL1, and a plurality of second diffraction patterns DFP1-2, whichare formed in the second insulating layer IL2, compared with the displaymodule DM shown in FIG. 5A. The second diffraction patterns DFP1-2 maybe disposed to correspond to the first diffraction patterns DFP1-1. Forexample, the second diffraction patterns DFP1-2 may be disposed on thefirst diffraction patterns DFP1-1.

Each of the first diffraction patterns DFP1-1 may be a first holepenetrating the first insulating layer ILL and each of the seconddiffraction patterns DFP1-2 may be a second hole penetrating the secondinsulating layer IL2. For example, the first insulating layers IL1includes a plurality of first holes penetrating the first insulatinglayers IL1 in the third direction DR3 and defining the first diffractionpatterns DFP1-1. The second insulating layer IL2 includes a plurality ofsecond holes penetrating the second insulating layer IL2 in the thirddirection DR3 and defining the second diffraction patterns DFP1-2. Thediffraction patterns DFP may include the holes defined by the first andsecond holes DFP1-1 and DFP1-2. The second inorganic encapsulation layerT-IL2, which is the topmost layer of the encapsulation layer TFE, may bepartially exposed by the holes DFP.

The first and second diffraction patterns DFP1-1 and DFP1-2 may have asubstantially similar structure to one of the diffraction patterns DFPand DFP1-DFP4 shown in FIGS. 6B to 7F. Thus, a detailed description ofthe structure of each of the first and second diffraction patternsDFP1-1 and DFP1-2 will be omitted to avoid redundancy.

The first and second diffraction patterns DFP1-1 and DFP1-2 may beoverlapped with the emission regions PXA-R, PXA-G, and PXA-B. The firstand second diffraction patterns DFP1-1 and DFP1-2 may be partiallyoverlapped with the non-emission regions NPXA-G, NPXA-R, and NPXA-B.

The input-sensing unit ISP may further include the protection layer PL.The protection layer PL may cover the second insulating layer IL2 andthe second conductive layers SP1, SP2, and CP2. In addition, theprotection layer PL may cover the second inorganic encapsulation layerT-IL2 exposed by the holes DFP. In other words, the protection layer PLmay be formed to fill the holes DFP.

The protection layer PL may be formed of or include an organic material.For example, the protection layer PL may be formed of or include anacrylic resin. The protection layer PL may be thicker than the first andsecond insulating layers IL1 and IL2. In addition, the protection layerPL may have a refractive index different from that of the first andsecond insulating layers IL1 and IL2. For example, the protection layerPL may have a refractive index of about 1.6, and the first and secondinsulating layers IL1 and IL2 may have a refractive index of about 1.9.Thus, light incident into the diffraction patterns DFP1-1 and DFP1-2 maybe diffracted by the diffraction patterns DFP1-1 and DFP1-2 and by thedifference in refractive index between the first and second insulatinglayers IL1 and IL2 and the protection layer PL filling the diffractionpatterns DFP1-1 and DFP1-2.

Referring to FIG. 8B, the first insulating layer IL1 may include a firstsub-insulating layer SIL1 and a second sub-insulating layer SIL2. Thefirst sub-insulating layer SIL1 may be directly disposed on theencapsulation layer TFE, and the second sub-insulating layer SIL2 may bedisposed on the first sub-insulating layer SIL1 The first and secondsub-insulating layers SIL1 and SIL2 may be formed of or include aninorganic material. In an exemplary embodiment, the first and secondsub-insulating layers SIL1 and SIL2 may be formed of or include the samematerial. For example, each of the first and second sub-insulatinglayers SIL1 and SIL2 may include a silicon nitride layer, and the firstsub-insulating layer SIL1 and the second sub-insulating layer SIL2 maybe formed under different deposition conditions.

The first diffraction patterns DFP1-1 provided in the first insulatinglayer IL1 may include a plurality of first sub-diffraction patternsSDFP1, which are provided in the first sub-insulating layer SIL1 and aplurality of second sub-diffraction patterns SDFP2, which are providedin the second sub-insulating layer SIL2. The second sub-diffractionpatterns SDFP2 may be disposed to correspond to the firstsub-diffraction patterns SDFP1. In addition, the second diffractionpatterns DFP1-2 may be disposed to correspond to the first diffractionpatterns DFP1-1 including the first and second sub-diffraction patternsSDFP1 and SDFP2.

Each of the first sub-diffraction patterns SDFP1 may be a first sub-holepenetrating the first sub-insulating layer SIL1 and each of the secondsub-diffraction patterns SDFP2 may be a second sub-hole penetrating thesecond sub-insulating layer SIL2. For example, the first sub-insulatinglayers SIL1 includes a plurality of first sub-holes penetrating thefirst sub-insulating layers SIL1 in the third direction DR3 and definingthe first sub-diffraction patterns SDFP1. The second sub-insulatinglayers SIL2 includes a plurality of second sub-holes penetrating thesecond sub-insulating layers SIL2 in the third direction DR3 anddefining the second sub-diffraction patterns SDFP2. The diffractionpatterns DFP may include the holes defined by the first sub-holes SDFP1,the second sub-holes SDFP2 and the second holes DFP1-2. The secondinorganic encapsulation layer T-IL2, which is the topmost layer of theencapsulation layer TFE, may be partially exposed by the holes DFP.

The input-sensing unit ISP may further include the protection layer PL.The protection layer PL may cover the second insulating layer IL2 andthe second conductive layers SP1, SP2, and CP2. In addition, theprotection layer PL may cover the second inorganic encapsulation layerT-IL2 exposed by the holes DFP. In other words, the protection layer PLmay be formed to fill the holes DFP.

Light incident into the diffraction patterns SDFP1, SDFP2, and DFP1-2may be diffracted by the diffraction patterns SDFP1, SDFP2, and DFP1-2and the difference in refractive index between the first and secondinsulating layers IL1 and IL2 and the protection layer PL filling thediffraction patterns SDFP1, SDFP2, and DFP1-2.

FIGS. 9A and 9B are sectional views of other exemplary embodiments ofthe display module of FIG. 1B.

Referring to FIG. 9A, the diffraction patterns DFP may be provided inthe first and second insulating layers IL1 and IL2. The diffractionpatterns DFP may include the first diffraction patterns DFP1-1, whichare formed in the first insulating layer Ill, and the second diffractionpatterns DFP1-2, which are formed in the second insulating layer IL2.Each of the first diffraction patterns DFP1-1 may be a hole-shapedstructure penetrating the first insulating layer IL1, and each of thesecond diffraction patterns DFP1-2 may be a hole-shaped structurepenetrating the second insulating layer IL2.

In an exemplary embodiment, the encapsulation layer TFE may includethird diffraction patterns DFP1-3, which are disposed to correspond tothe first and second diffraction patterns DFP1-1 and DFP1-2. Forexample, the third diffraction patterns DFP1-3 may be provided in thesecond inorganic encapsulation layer T-IL2, which is the topmost layerof the encapsulation layer TFE. Each of the third diffraction patternsDFP1-3 may be a recessed-shaped structure (such as a groove), which isconcavely recessed relative to the top surface of the second inorganicencapsulation layer T-IL2. However, exemplary embodiments are notlimited thereto. For example, the third diffraction pattern DFP1-3 maybe a hole-shaped structure penetrating the second inorganicencapsulation layer T-IL2.

The first to third diffraction patterns DFP1-1 to DFP1-3 may be formedin the first insulating layer IL1, the second insulating layer IL2, andthe second inorganic encapsulation layer T-IL2, respectively, and theprotection layer PL may be provided to fill regions, in which the firstto third diffraction patterns DFP1-1 to DFP1-3 are formed. Thus, lightemitted from the emission layer EML may be diffracted by a difference inrefractive index between the second inorganic encapsulation layer T-IL2and the protection layer PL and between the first and second insulatinglayers IL1 and IL2 and the protection layer PL.

Referring to FIG. 9B, the encapsulation layer TFE may include thirddiffraction patterns DFP1-3, which are disposed to correspond to thefirst and second sub-diffraction patterns SDFP1 and SDFP2. For example,the third diffraction patterns DFP1-3 may be provided in the secondinorganic encapsulation layer T-IL2, which is the topmost layer of theencapsulation layer TFE. Each of the third diffraction patterns DFP1-3may be a recessed-shaped structure (such as a groove), which isconcavely recessed relative to the top surface of the second inorganicencapsulation layer T-IL2. However, exemplary embodiments are notlimited thereto. For example, the third diffraction pattern DFP1-3 maybe a hole-shaped structure penetrating the second inorganicencapsulation layer T-IL2.

FIG. 10 is a sectional view of another exemplary embodiment of thedisplay module of FIG. 1B.

Referring to FIG. 10 , the input-sensing unit ISP may further include athird insulating layer IL3 disposed between the protection layer PL andthe second insulating layer IL2. The third insulating layer IL3 may beformed of or include an inorganic material. For example, the thirdinsulating layer IL3 may include a silicon nitride layer. In anexemplary embodiment, the third insulating layer IL3 may be thicker thanthe first and second insulating layers IL1 and IL2.

In an exemplary embodiment, a plurality of diffraction patterns DFP2-2may be provided in the third insulating layer IL3. The diffractionpatterns DFP2-2 may have a substantially similar structure to one of thediffraction patterns DFP and DFP1-DFP4 shown in FIGS. 6B to 7F. Thediffraction patterns DFP2-2 may diffract at least a portion of lightemitted from the emission layer EML. For example, the diffractionpatterns DFP2-2 may diffract at least a portion of light incident intothe input-sensing unit ISP.

In an exemplary embodiment, each of the diffraction patterns DFP2-2 maybe a hole penetrating the third insulating layer IL3. For example, thethird insulating layer IL3 may include a plurality of holes penetratingthe third insulating layer IL3 in the third direction DR3 and definingthe diffraction patterns DFP2-2. The second insulating layer IL2 may bepartially exposed by the diffraction patterns DFP2-2.

The protection layer PL may be disposed on the third insulating layerIL3. The holes DFP2-2 may be filled with the protection layer PL. Thus,light emitted from each emission layer EML may be diffracted due to thedifference in refractive index between the third insulating layer IL3and the protection layer PL.

FIGS. 11A and 11B are sectional views of other exemplary embodiments ofthe display module of FIG. 1B.

Referring to FIG. 11A, the input-sensing unit ISP may include thediffraction patterns DFP, which are formed in the second insulatinglayer IL2. The input-sensing unit ISP may further include a fourthinsulating layer OL1 disposed below the second insulating layer IL2. Thefourth insulating layer OL1 may be disposed between the first and secondinsulating layers IL1 and IL2. The fourth insulating layer OL1 may beformed of or include an organic material. In an exemplary embodiment,the fourth insulating layer OL1 may be formed of or include an acrylicresin. The fourth insulating layer OL1 may be formed of the same organicmaterial as the protection layer PL, but the fourth insulating layer OL1may be formed under a process condition different from that for theprotection layer PL. For example, each of the fourth insulating layerOL1 and the protection layer PL may be formed of or include a negativephotoresist material, and a photo-curing temperature of the fourthinsulating layer OL1 may be higher than that of the protection layer PL.

The fourth insulating layer OL1 may be thicker than the first insulatinglayer IL1. In an exemplary embodiment, the fourth insulating layer OL1may have a thickness range from about 1.0 μm to about 10 μm. Due to thefourth insulating layer OL1 interposed between the first insulatinglayer IL1 and the second insulating layer IL2, the distance between thediffraction patterns DFP of the second insulating layer IL2 and theorganic light emitting diode OLED may be increased.

Referring to FIG. 11B, the input-sensing unit ISP may further include afifth insulating layer OL2, which is disposed below the secondinsulating layer IL2 provided with the diffraction patterns DFP. Thefifth insulating layer OL2 may be disposed between the first insulatinglayer IL1 and the encapsulation layer TFE. For example, the fifthinsulating layer OL2 may be disposed between the first insulating layerIL1 and the second inorganic encapsulation layer T-IL2. The fifthinsulating layer OL2 may be formed of or include an organic material. Inan exemplary embodiment, the fifth insulating layer OL2 may be formed ofor include an acrylic resin. The fifth insulating layer OL2 may beformed of the same organic material as the protection layer PL, but inan exemplary embodiment, the fifth insulating layer OL2 may be formedunder a process condition different from that for the protection layerPL. For example, each of the fifth insulating layer OL2 and theprotection layer PL may be formed of or include a negative photoresistmaterial, and a photo-curing temperature of the fifth insulating layerOL2 may be higher than that of the protection layer PL.

To form a desired distance between the diffraction patterns DFP and theorganic light emitting diode OLED, the thickness of each of the fourthand fifth insulating layers OL1 and OL2 may be adjusted or at least oneof the fourth and fifth insulating layers OL1 and OL2 may be omitted.

FIG. 12 is an enlarged plan view of the region ‘FF’ of FIG. 3illustrating another exemplary embodiment of the input-sensing unit ofFIG. 3 , and FIGS. 13A to 13E are sectional views taken along a lineIV-IV′ of FIG. 12 illustrating exemplary embodiments of the displaymodule of FIG. 1B.

Referring to FIG. 12 , the input-sensing unit ISP may include reddiffraction patterns DFP-R, which are arranged at a substantiallyconstant pitch and diffract at least a portion of light incident intothe input-sensing unit ISP. The red diffraction patterns DFP-R may bedisposed to correspond to at least one of the pixels PX-R, PX-G, andPX-B. In an exemplary embodiment, the red diffraction patterns DFP-R maybe disposed to correspond to the first pixel PX-R of the first to thirdpixels PX-R, PX-G, and PX-B. Thus, the red diffraction patterns DFP-Rmay diffract a portion (i.e., a lateral red light) of red light that isincident into the input-sensing unit ISP. The red diffraction patternsDFP-R may be overlapped with the first emission region PXA-R of thefirst to third emission regions PXA-R, PXA-G, and PXA-B. The reddiffraction patterns DFP-R may be overlapped with the first non-emissionregion NPXA-R adjacent to the first emission region PXA-R.

The red diffraction patterns DFP-R may not be overlapped with thenon-pixel region NPA. In other words, the red diffraction patterns DFP-Rmay be provided in such a way that they are not overlapped with the meshelectrode MSE.

In an exemplary embodiment, the red diffraction patterns DFP-R may havea generally circular shape, when viewed in plan. However, exemplaryembodiments are not limited to a specific shape of the diffractionpatterns DFP-R. For example, the red diffraction patterns DFP-R may beprovided to have various shapes (e.g., generally polygonal, elliptical,and elongated shapes).

Referring to FIGS. 3, 12, and 13A, the input-sensing unit ISP mayinclude the first insulating layer Ill, a first conductive layerthereon, the second insulating layer IL2 covering the first conductivelayer, and a second conductive layer disposed on the second insulatinglayer IL2.

The first conductive layer may be disposed on the first insulating layerIL1. The first conductive layer may include the first connecting portionCP1. The second conductive layer may include the first sensing portionSP1, the second sensing portion SP2, and the second connecting portionCP2.

The second insulating layer IL2 may be disposed between the firstconductive layer and the second conductive layer. The second insulatinglayer IL2 may separate the first conductive layer from the secondconductive layer, when viewed in cross section.

The first and second insulating layers IL1 and IL2 may be formed of orinclude an inorganic material. For example, at least one or both of thefirst and second insulating layers IL1 and IL2 may include a siliconnitride layer. In an exemplary embodiment, the second insulating layerIL2 may be thicker than the first insulating layer IL1.

The red diffraction patterns DFP-R may be formed in at least one of thefirst and second insulating layers IL1 and IL2. In an exemplaryembodiment, the red diffraction patterns DFP-R may be formed in thesecond insulating layer IL2, as shown in FIG. 13A, but exemplaryembodiments are not limited thereto.

The red diffraction patterns DFP-R may be disposed in the first emissionregion PXA-R of the first to third emission regions PXA-R, PXA-G, andPXA-B. The red diffraction patterns DFP-R may be arranged at asubstantially constant pitch. The red diffraction patterns DFP-R maydiffract a portion of light (hereinafter, red light) emitted from theemission layer EML in the first emission region PXA-R. For example, thered diffraction patterns DFP-R may diffract a portion (i.e., a lateralred light) of the red light propagating in a lateral direction.

FIG. 13A illustrates a structure in which the red diffraction patternsDFP-R are provided to correspond to the first pixel PX-R, but exemplaryembodiments are not limited thereto. In an exemplary embodiment, the reddiffraction patterns DFP-R may be provided to correspond to at least oneof the first to third pixels PX-R, PX-G, and PX-B. For example, the reddiffraction patterns DFP-R may be provided to correspond to the secondor third pixel PX-G or PX-B of the first to third pixels PX-R, PX-G, andPX-B or may be provided to correspond to some (e.g., the first andsecond pixels PX-R and PX-G, the first and third pixels PX-R and PX-B,or the second and third pixels PX-G and PX-B) of the first to thirdpixels PX-R, PX-G, and PX-B.

Referring to FIG. 13B, the red diffraction patterns DFP-R may include inthe first and second insulating layers IL1 and IL2 to correspond to thefirst emission region PXA-R. The red diffraction patterns DFP-R mayinclude a plurality of first diffraction patterns DFP1-R, which areformed in the first insulating layer IL1, and a plurality of seconddiffraction patterns DFP2-R, which are formed in the second insulatinglayer IL2.

Each of the first diffraction patterns DFP1-R may be a first holepenetrating the first insulating layer IL1, and each of the seconddiffraction patterns DFP2-R may be a second hole penetrating the secondinsulating layer IL2. For example, the first insulating layer IL1 mayinclude a plurality of first holes penetrating the first insulatinglayer IL1 in the third direction DR3 to define the first diffractionpatterns DFP1-R. The second insulating layer IL2 may include a pluralityof second holes penetrating the second insulating layers IL2 in thethird direction DR3 to define the second diffraction patterns DFP2-R.The red diffraction patterns DFP-R may include the holes defined by thefirst and second holes DFP1-R and DFP2-R. The second inorganicencapsulation layer T-IL2, which is the topmost layer of theencapsulation layer TFE, may be partially exposed by the holes DFP-R.

The first and second diffraction patterns DFP1-R and DFP2-R may have astructure substantially similar to one of the diffraction patterns DFPand DFP1-DFP4 shown in FIGS. 6B to 7F. Thus, a detailed description ofthe structure of each of the first and second diffraction patternsDFP1-R and DFP2-R will be omitted to avoid redundancy.

Referring to FIG. 13C, the first insulating layer IL1 may include thefirst sub-insulating layer SIL1 and the second sub-insulating layerSIL2. The first sub-insulating layer SIL1 may be directly disposed onthe encapsulation layer TFE, and the second sub-insulating layer SIL2may be disposed on the first sub-insulating layer SIL1 The first andsecond sub-insulating layers SIL1 and SIL2 may be formed of or includean inorganic material. In an exemplary embodiment, the first and secondsub-insulating layers SIL1 and SIL2 may be formed of or include the samematerial. For example, each of the first and second sub-insulatinglayers SIL1 and SIL2 may include a silicon nitride layer, and the firstsub-insulating layer SIL1 and the second sub-insulating layer SIL2 maybe formed under different deposition conditions.

The first diffraction patterns DFP1-R, which are provided in the firstinsulating layer IL1 to correspond to the first emission region PXA-R,may include a plurality of first sub-diffraction patterns SDFP1-R, whichare provided in the first sub-insulating layer SILL, and a plurality ofsecond sub-diffraction patterns SDFP2-R, which are provided in thesecond sub-insulating layer SIL2. The second sub-diffraction patternsSDFP2-R may be disposed to correspond to the first sub-diffractionpatterns SDFP1-R. In addition, the second diffraction patterns DFP2-Rmay be disposed to correspond to the first and second sub-diffractionpatterns SDFP1-R and SDFP2-R.

Each of the first sub-diffraction patterns SDFP1-R may be a firstsub-hole penetrating the first sub-insulating layer SIL1 and each of thesecond sub-diffraction patterns SDFP2-R may be a second sub-holepenetrating the second sub-insulating layer SIL2. For example, the firstsub-insulating layer SIL1 may include a plurality of first sub-holespenetrating the first sub-insulating layers SIL1 in the third directionDR3 to define the first sub-diffraction pattern SDFP1-R. The secondsub-insulating layer SIL2 may include a plurality of second sub-holespenetrating the second sub-insulating layers SIL2 in the third directionDR3 to define the second sub-diffraction pattern SDFP2-R. The reddiffraction patterns DFP-R may include the holes defined by the firstsub-holes SDFP1-R, the second sub-holes SDFP2-R and the second holesDFP2-R. The second inorganic encapsulation layer T-IL2, which is thetopmost layer of the encapsulation layer TFE, may be partially exposedby the holes of the red diffraction patterns DFP-R.

Referring to FIG. 13D, the red diffraction patterns DFP-R may be formedin the first and second insulating layers IL1 and IL2 to correspond tothe first emission region PXA-R. For example, the first diffractionpatterns DFP1-R may be formed in the first insulating layer Ill, and thesecond diffraction patterns DFP2-R may be formed in the secondinsulating layer IL2.

In an exemplary embodiment, the encapsulation layer TFE may includethird diffraction patterns DFP3-R, which are disposed to correspond tothe first and second diffraction patterns DFP1-R and DFP2-R. Forexample, the third diffraction patterns DFP3-R may be provided in thesecond inorganic encapsulation layer T-IL2, which is the topmost layerof the encapsulation layer TFE. The third diffraction patterns DFP3-Rmay be a recessed-shaped structure, which is concavely recessed relativeto the top surface of the second inorganic encapsulation layer T-IL2.However, exemplary embodiments are not limited thereto. For example, inan exemplary embodiment, the third diffraction pattern DFP3-R may be ahole-shaped structure penetrating the second inorganic encapsulationlayer T-IL2.

As an example, in the case where the first insulating layer IL1 includesthe first and second sub-insulating layers SIL1 and SIL2 of FIG. 13C,the first diffraction patterns DFP1-R provided in the first insulatinglayer IL1 may include the first sub-diffraction patterns SDFP1-R (e.g.,see FIG. 13C) provided in the first sub-insulating layer SIL1 and thesecond sub-diffraction patterns SDFP2-R (e.g., see FIG. 13C) provided inthe second sub-insulating layer SIL2. In this case, the thirddiffraction patterns DFP3-R of the encapsulation layer TFE may bedisposed to correspond to the first and second sub-diffraction patternsSDFP1-R and SDFP2-R.

Referring to FIG. 13E, the input-sensing unit ISP may further includethe third insulating layer IL3 disposed between the protection layer PLand the second insulating layer IL2. The third insulating layer IL3 maybe formed of or include an inorganic material. For example, the thirdinsulating layer IL3 may include a silicon nitride layer. In anexemplary embodiment, the third insulating layer IL3 may be thicker thanthe first and second insulating layers IL1 and IL2.

In an exemplary embodiment, a plurality of red diffraction patternsDFP4-R may be provided in the third insulating layer IL3 to correspondto the first emission region PXA-R. The red diffraction patterns DFP4-Rmay have a substantially similar structure as one of the diffractionpatterns DFP and DFP1-DFP4 shown in FIGS. 6B to 7F. The red diffractionpatterns DFP4-R may diffract at least a portion of the red light emittedfrom the emission layer EML of the first pixel PX-R. For example, thered diffraction patterns DFP4-R may diffract at least a portion of thered light propagating toward the input-sensing unit ISP.

In an exemplary embodiment, each of the red diffraction patterns DFP4-Rmay be a hole penetrating the third insulating layer IL3. For example,the third insulating layer IL3 may include a plurality of third holespenetrating the third insulating layer IL3 in the third direction DR3and being defined as the red diffraction patterns DFP4-R. The secondinsulating layer IL2 may be partially exposed by the red diffractionpatterns DFP4-R.

The protection layer PL may be disposed on the third insulating layerIL3. A plurality of holes DFP4-R may be filled with the protection layerPL. Thus, the red light emitted from each emission layer EML may bediffracted by a difference in refractive index between the thirdinsulating layer IL3 and the protection layer PL and by the reddiffraction patterns DFP4-R.

FIG. 14A is a graph showing brightness ratios of red, green, and bluelights versus viewing angle, FIG. 14B is a graph showing correlatedcolor temperature (CCT) characteristics versus viewing angle, and FIG.14C is a graph showing minimum perceptible color difference (MPCD)characteristics versus viewing angle.

In FIG. 14A, a first R graph G-R1 shows a variation in brightness ratioof red light versus viewing angle in a comparative example, in which thediffraction patterns were not formed in the first to third pixels PX-R,PX-G, and PX-B, and a G graph G-G shows a variation in brightness ratioof green light versus viewing angle in the comparative example, in whichthe diffraction patterns were not formed in the first to third pixelsPX-R, PX-G, and PX-B. A B graph G-B shows a variation in brightnessratio of blue light versus viewing angle in the comparative example, inwhich the diffraction patterns were not formed in the first to thirdpixels PX-R, PX-G, and PX-B, and a second R graph G-R2 shows a variationin brightness ratio of red light versus viewing angle in an exemplaryembodiment, in which the red diffraction patterns DFP-R were formed tocorrespond to the first pixel PX-R.

In FIG. 14B, a first graph G1 shows a variation in correlated colortemperature (CCT) characteristics versus viewing angle in thecomparative example, in which the diffraction patterns were not formedin the first to third pixels PX-R, PX-G, and PX-B, and a second graph G2shows a variation in CCT characteristics versus viewing angle in theexemplary embodiment, in which the red diffraction patterns DFP-R wereformed to correspond to the first pixel PX-R.

In FIG. 14C, a third graph G3 shows a variation in minimum perceptiblecolor difference (MPCD) characteristics versus viewing angle in thecomparative example, in which the diffraction patterns were not formedin the first to third pixels PX-R, PX-G, and PX-B, and a fourth graph G4shows a variation in MPCD characteristics versus viewing angle in theexemplary embodiment, in which the red diffraction patterns DFP-R wereformed to correspond to the first pixel PX-R.

FIG. 14A shows that, in the comparative example, in which thediffraction patterns were not formed in the first to third pixels PX-R,PX-G, and PX-B, the brightness ratio of the green light was increasedbut the brightness ratios of the red and blue lights were decreased,when the viewing angle was increased. However, in the case where the reddiffraction patterns DFP-R were formed to correspond to the first pixelPX-R, the brightness ratio of the red light was maintained to asubstantially constant level, even when the viewing angle was increased.This shows that, in the case where the red light emitted from the firstpixel PX-R is diffracted by the red diffraction patterns DFP-R, it ispossible to increase a brightness ratio of the red light in a lateraldirection. Furthermore, this result shows that it is possible toincrease the viewing angle and to improve a greenish phenomenon, inwhich green light is more distinctly recognized.

By contrast, in the case where the red diffraction patterns DFP-R wereformed to correspond to the first pixel PX-R, a variation of the CCTcharacteristics caused by a variation of the viewing angle was reduced,compared with the comparative example, as shown in FIGS. 14B and 14C.Furthermore, in the case where the red diffraction patterns DFP-R wereformed to correspond to the first pixel PX-R, even when the viewingangle was increased, a rate of the increase of the MPCD characteristicswas reduced, compared with the comparative example.

In the case where, as described above, the diffraction patterns DFP-Rare provided in a specific pixel PX-R, it may be possible to improve aphenomenon, in which light of a specific color is more distinctlyrecognized, and consequently to improve the overall viewing anglecharacteristic.

FIG. 15 is an enlarged plan view of the region ‘FF’ of FIG. 3illustrating another exemplary embodiment of the input-sensing unit ofFIG. 3 , and FIGS. 16A to 16C are sectional views taken along a lineV-V′ of FIG. 15 illustrating the display module of FIG. 1B.

Referring to FIG. 15 , the input-sensing unit ISP may include aplurality of diffraction patterns DFP-R and DFP-B, which are arranged ata substantially constant pitch and diffract at least a portion of lightincident into the input-sensing unit ISP. The diffraction patterns DFP-Rand DFP-B may be disposed to correspond to at least one (e.g., twopixels) of the pixels PX-R, PX-G, and PX-B. In an exemplary embodiment,the diffraction patterns DFP-R and DFP-B may include a plurality of reddiffraction patterns DFP-R and a plurality of blue diffraction patternsDFP-B. The red diffraction patterns DFP-R may be disposed to correspondto the first pixel PX-R of the first to third pixels PX-R, PX-G, andPX-B, and the blue diffraction patterns DFP-B may be disposed tocorrespond to the third pixel PX-B of the first to third pixels PX-R,PX-G, and PX-B. In an exemplary embodiment, the diffraction patterns mayinclude green diffraction patterns, which are disposed to correspond tothe second pixel PX-G, and the blue diffraction patterns DFP-B, whichare disposed to correspond to the third pixel PX-B.

The red diffraction patterns DFP-R may diffract a portion of the redlight incident into the input-sensing unit ISP, and the blue diffractionpatterns DFP-B may diffract a portion of the blue light incident intothe input-sensing unit ISP.

The red and blue diffraction patterns DFP-R and DFP-B may berespectively overlapped with the first and third emission regions PXA-Rand PXA-B of the first to third emission regions PXA-R, PXA-G, andPXA-B. The red diffraction patterns DFP-R may also be overlapped withthe first non-emission region NPXA-R adjacent to the first emissionregion PXA-R, and the blue diffraction patterns DFP-B may also beoverlapped with the third non-emission region NPXA-B adjacent to thethird emission region PXA-B.

The red and blue diffraction patterns DFP-R and DFP-B may not beoverlapped with the non-pixel region NPA. In other words, thediffraction patterns DFP-R and DFP-B may be provided in such a way thatthey are not overlapped with the mesh electrode MSE.

In an exemplary embodiment, the red and blue diffraction patterns DFP-Rand DFP-B may have a generally circular shape, when viewed in plan.However, exemplary embodiments are not limited to a specific shape ofthe red and blue diffraction patterns DFP-R and DFP-B. In an exemplaryembodiment, the red and blue diffraction patterns DFP-R and DFP-B mayhave the same shape, when viewed in plan. However, exemplary embodimentsare not limited thereto. For example, the red and blue diffractionpatterns DFP-R and DFP-B may have different shapes from each other, whenviewed in plan.

Referring to FIGS. 3, 15, and 16A, the input-sensing unit ISP mayinclude the first insulating layer Ill, a first conductive layerthereon, the second insulating layer IL2 covering the first conductivelayer, and a second conductive layer disposed on the second insulatinglayer IL2.

The red diffraction patterns DFP-R and the blue diffraction patternsDFP-B may be formed in at least one of the first and second insulatinglayers IL1 and IL2. FIG. 16A illustrates the red and blue diffractionpatterns DFP-R and DFP-B formed in the second insulating layer IL2, butexemplary embodiments are not limited thereto.

The red diffraction patterns DFP-R may be disposed in the first emissionregion PXA-R of the first to third emission regions PXA-R, PXA-G, andPXA-B, and the blue diffraction patterns DFP-B may be disposed in thethird emission region PXA-B. The red diffraction patterns DFP-R and theblue diffraction patterns DFP-B may be arranged at substantiallyconstant pitches. The red diffraction patterns DFP-R may diffract atleast a portion of light (hereinafter, red light) emitted from theemission layer EML in the first emission region PXA-R. For example, thered diffraction patterns DFP-R may diffract at least a portion of thered light propagating toward the input-sensing unit ISP. The bluediffraction patterns DFP-B may diffract at least a portion of light(hereinafter, blue light) emitted from the emission layer EML in thethird emission region PXA-B. For example, the blue diffraction patternsDFP-B may diffract at least a portion of the blue light propagatingtoward the input-sensing unit ISP.

Referring to FIG. 16B, the red diffraction patterns DFP-R may be formedin the first and second insulating layers IL1 and IL2 to correspond tothe first emission region PXA-R, and the blue diffraction patterns DFP-Bmay be formed in the first and second insulating layers IL1 and IL2 tocorrespond to the third emission region PXA-B. The red diffractionpatterns DFP-R may include a plurality of first red diffraction patternsDFP1-R, which are formed in the first insulating layer Ill, and aplurality of second red diffraction patterns DFP2-R, which are formed inthe second insulating layer IL2. In particular, the second reddiffraction patterns DFP2-R may be disposed to correspond to the firstred diffraction patterns DFP1-R. For example, the second red diffractionpatterns DFP2-R may be disposed on the first red diffraction patternsDFP1-R. The blue diffraction patterns DFP-B may include a plurality offirst blue diffraction patterns DFP1-B, which are formed in the firstinsulating layer ILL and a plurality of second blue diffraction patternsDFP2-B, which are formed in the second insulating layer IL2. Inparticular, the second blue diffraction patterns DFP2-B may be disposedto correspond to the first blue diffraction patterns DFP1-B. In otherwords, the second blue diffraction patterns DFP2-B may be disposed onthe first blue diffraction patterns DFP1-B.

Each of the first red diffraction patterns DFP1-R and the first bluediffraction patterns DFP1-B may be a hole-shaped structure penetratingthe first insulating layer Ill, and each of the second red diffractionpatterns DFP2-R and the second blue diffraction patterns DFP2-B may be ahole-shaped structure penetrating the second insulating layer IL2. Forexample, the first insulating layer IL1 may include a plurality of firstred holes and a plurality of first blue holes, which are formed topenetrate the first insulating layer IL1 in the third direction DR3. Theplurality of first red holes may be defined as the first red diffractionpatterns DFP1-R and the plurality of first blue holes may be defined asthe first blue diffraction patterns DFP1-B. The second insulating layerIL2 may include a plurality of second red holes and a plurality ofsecond blue holes, which are formed to penetrate the second insulatinglayer IL2 in the third direction DR3. The plurality of second red holesmay be defined as the second red diffraction patterns DFP2-R and theplurality of second blue holes may be defined as the second bluediffraction patterns DFP2-B. The red diffraction patterns DFP-R mayinclude the first holes defined by the first red-holes DFP1-R and thesecond red-holes DFP2-R and the blue diffraction patterns DFP-B mayinclude the second holes defined by the first blue-holes DFP1-B and thesecond blue-holes DFP2-B. The second inorganic encapsulation layerT-IL2, which is the topmost layer of the encapsulation layer TFE, may bepartially exposed by the first and second holes DFP-R and DFP-B.

The red and blue diffraction patterns DFP-R and DFP-B may have asubstantially similar structure as one of the diffraction patterns DFPand DFP1-DFP4 shown in FIGS. 6B to 7F. Thus, a detailed description ofthe structure of each of the red and blue diffraction patterns DFP-R andDFP-B will be omitted to avoid redundancy.

In an exemplary embodiment, the first insulating layer IL1 may includethe first sub-insulating layer SIL1 and the second sub-insulating layerSIL2, shown in FIG. 13C. In this case, the first red diffractionpatterns DFP1-R may include first sub-red diffraction patterns providedin the first sub-insulating layer SIL1 and second sub-red diffractionpatterns provided in the second sub-insulating layer SIL2. In addition,the first blue diffraction patterns DFP1-B may include first sub-bluediffraction patterns, which are provided in the first sub-insulatinglayer SIL1 and second sub-blue diffraction patterns, which are providedin the second sub-insulating layer SIL2.

In addition, third red diffraction patterns corresponding to the firstred diffraction patterns DFP1-R and third blue diffraction patternscorresponding to the first blue diffraction patterns DFP1-B may beprovided in the encapsulation layer TFE. In the case where the firstinsulating layer IL1 includes the first sub-insulating layer SIL1 andthe second sub-insulating layer SIL2, the first sub-red diffractionpatterns and the second sub-red diffraction patterns may be disposed tocorrespond to the third red diffraction patterns provided in theencapsulation layer TFE. Also, in the case where the first insulatinglayer IL1 includes the first sub-insulating layer SIL1 and the secondsub-insulating layer SIL2, the first sub-blue diffraction patterns andthe second sub-blue diffraction patterns may be disposed to correspondto the third blue diffraction patterns provided in the encapsulationlayer TFE.

Referring to FIG. 16C, the input-sensing unit ISP may further includethe third insulating layer IL3 disposed between the protection layer PLand the second insulating layer IL2.

In an exemplary embodiment, a plurality of red diffraction patternsDFP4-R may be provided in the third insulating layer IL3 to correspondto the first emission region PXA-R, and a plurality of blue diffractionpatterns DFP4-B may be provided in the third insulating layer IL3 tocorrespond to the third emission region PXA-B. Each of the red and bluediffraction patterns DFP4-R and DFP4-B may have a substantially similarstructure as one of the diffraction patterns DFP and DFP1-DFP4 shown inFIGS. 6B to 7F. The red diffraction patterns DFP4-R may diffract atleast a portion of red light emitted from the emission layer EML of thefirst pixel PX-R, and the blue diffraction patterns DFP4-B may diffractat least a portion of blue light emitted from the emission layer EML ofthe third pixel PX-B.

In an exemplary embodiment, each of the red and blue diffractionpatterns DFP4-R and DFP4-B may be a hole-shaped structure penetratingthe third insulating layer IL3. Thus, is the second insulating layer IL2may be partially exposed by the red and blue diffraction patterns DFP4-Rand DFP4-B.

The protection layer PL may be disposed on the third insulating layerIL3. The red and blue diffraction patterns DFP4-R and DFP4-B may befilled with the protection layer PL. Thus, red and blue lights emittedfrom each emission layer EML may be diffracted due to the difference inrefractive index between the third insulating layer IL3 and theprotection layer PL.

FIG. 17A is a graph showing correlated color temperature (CCT)characteristics versus viewing angle, and FIG. 17B is a graph showingminimum perceptible color difference (MPCD) characteristics versusviewing angle.

In FIG. 17A, a fifth graph G5 shows a variation in CCT characteristicsversus viewing angle in the comparative example, in which thediffraction patterns were not formed in the first to third pixels PX-R,PX-G, and PX-B, and a sixth graph G6 shows a variation in CCTcharacteristics versus viewing angle in the exemplary embodiment, inwhich the red and blue diffraction patterns DFP-R and DFP-B were formedto correspond to the first and third pixels PX-R and PX-B respectively.

In FIG. 17B, a seventh graph G7 shows a variation in MPCDcharacteristics versus viewing angle in the comparative example, inwhich the diffraction patterns were not formed in the first to thirdpixels PX-R, PX-G, and PX-B, and an eighth graph G8 shows a variation inMPCD characteristics versus viewing angle in the exemplary embodiment,in which the red and blue diffraction patterns DFP-R and DFP-B wereformed to correspond to the first and third pixels PX-R and PX-Brespectively.

In the case where the red and blue diffraction patterns DFP-R and DFP-Bwere respectively formed to correspond to the first and third pixelsPX-R and PX-B, the variation of the CCT characteristics caused by thevariation of the viewing angle was reduced, compared with thecomparative example, as shown in FIGS. 17A and 17B. Furthermore, in thecase where the red and blue diffraction patterns DFP-R and DFP-B wereformed to correspond to the first and third pixels PX-R and PX-Brespectively, even when the viewing angle was increased, the rate of theincrease of the MPCD characteristics was reduced, compared with thecomparative example.

In the case where, as described above, the diffraction patterns DFP-Rand DFP-B are provided in specific pixels PX-R and PX-B respectively, itmay be possible to improve the phenomenon, in which light of a specificcolor is more distinctly recognized, and consequently to improve theoverall viewing angle characteristic.

FIG. 18 is a plan view of another exemplary embodiment of theinput-sensing unit of the display device FIG. 1B, and FIG. 19 is asectional view of another exemplary embodiment of the display module ofFIG. 1B.

Referring to FIG. 18 , an input-sensing unit ISP2 may include aplurality of sensing electrodes IE and a plurality of signal lines SL.The sensing electrodes IE may have specific coordinate information. Forexample, the sensing electrodes IE may be arranged in a matrix shape andmay be connected to the signal lines SL, respectively. The sensingelectrodes IE and the signal lines SL may be disposed in the activeregion AA. Each of the signal lines SL may include a portion, which isdisposed in the active region AA, and another portion, which is disposedin the peripheral region NAA. In the illustrated exemplary embodiment,an input-sensing unit ISP2 may be configured to obtain information ofcoordinates of an external input in a self-capacitance manner.

The input-sensing unit ISP2 may extend from ends of the signal lines SLand may include the input pads I-PD, which are disposed in theperipheral region NAA. The pad portion PLD of the input-sensing unitISP2 according to the illustrated embodiment may have a structuresubstantially similar to the pad portion PLD of the input-sensing unitISP shown in FIG. 3 .

In the illustrated exemplary embodiment, each of the sensing electrodesIE may have a mesh shape.

As shown in FIG. 19 , the input-sensing unit ISP2 may include aninsulating layer IL, a conductive layer disposed on the insulating layerIL, and the protection layer PL covering the conductive layer. Theinsulating layer IL may be formed of or include an inorganic material.For example, the insulating layer IL may include a silicon nitridelayer. The conductive layer may be disposed on the insulating layer IL.The conductive layer may include the sensing electrodes IE.

A plurality of diffraction patterns DFP5 may be formed in the insulatinglayer IL. The diffraction patterns DFP5 may be arranged at asubstantially constant pitch and may diffract at least a portion oflight emitted from the emission layer EML. For example, the diffractionpatterns DFP5 may diffract at least a portion of light propagatingtoward the input-sensing unit ISP2. Each of the diffraction patternsDFP5 may be a hole-shaped structure penetrating the insulating layer IL.Thus, the top surface of the encapsulation layer TFE may be partiallyexposed by the diffraction patterns DFP5.

The diffraction patterns DFP5 may be overlapped with the emissionregions PXA-G, PXA-R, and PXA-B. The diffraction patterns DFP5 may bepartially overlapped with the non-emission regions NPXA-G, NPXA-R, andNPXA-B.

The diffraction patterns DFP5 may not be overlapped with the non-pixelregion NPA. The sensing electrodes IE may be disposed to correspond tothe non-pixel region NPA. Thus, the diffraction patterns DFP5 may beprovided in such a way that they are not overlapped with the sensingelectrodes IE.

The protection layer PL may cover the top surface of the encapsulationlayer TFE exposed by the diffraction patterns DFP5. For example, theprotection layer PL may be formed to fill a plurality of holes of thediffraction patterns DFP5.

The protection layer PL may be formed of or include an organic material.The protection layer PL may be formed of or include an acrylic resin.The protection layer PL may be thicker than the insulating layer IL. Inaddition, the protection layer PL may have a refractive index differentfrom the insulating layer IL. For example, the protection layer PL mayhave a refractive index of about 1.6, and the insulating layer IL mayhave a refractive index of about 1.9.

FIG. 19 illustrates a structure, in which the diffraction patterns DFP5are disposed to correspond to each of the first to third emissionregions PXA-R, PXA-G, and PXA-B. However, exemplary embodiments are notlimited thereto. For example, the diffraction patterns DFP5 may bedisposed to correspond to some emission regions (e.g., the firstemission region PXA-R or the first and third emission regions PXA-R andPXA-B) of the first to third emission regions PXA-R, PXA-G, and PXA-B.

FIG. 20 is a sectional view of another exemplary embodiment of thedisplay module of FIG. 1B, and FIG. 21 is a sectional view of anotherexemplary embodiment of the display module of FIG. 1B. FIG. 22 is asectional view of another exemplary embodiment of the display module ofFIG. 1B, and FIG. 23 is a sectional view of another exemplary embodimentof the display module of FIG. 1B.

Referring to FIG. 20 , the display module DM may include a diffractionpattern layer DFL, which is configured to diffract at least a portion oflight emitted from the display panel DP. The diffraction pattern layerDFL may be formed of or include one of inorganic and organic materials.

The diffraction pattern layer DFL may include the diffraction patternsDFP-R that are arranged at a substantially constant pitch. In anexemplary embodiment, the diffraction pattern layer DFL may be directlydisposed on the input-sensing unit ISP3. For example, the diffractionpattern layer DFL may be disposed on the protection layer PL of theinput-sensing unit ISP3.

The diffraction patterns DFP-R may include the red diffraction patternsDFP-R, which are disposed to correspond to at least one (e.g., the firstpixel PX-R) of the first to third pixels PX-R, PX-G, and PX-B.

Each of the red diffraction patterns DFP-R may be a hole penetrating thediffraction pattern layer DFL. For example, the diffraction patternlayer DFL may include the holes, which penetrate the diffraction patternlayer DFL and serve as the red diffraction patterns DFP-R. Theprotection layer PL, which is the topmost layer of the input-sensingunit ISP3, may be partially exposed by the holes DFP-R.

The red diffraction patterns DFP-R may be overlapped with the firstemission region PXA-R of the emission regions PXA-R, PXA-G, and PXA-B.In addition, the red diffraction patterns DFP-R may be partiallyoverlapped with the first non-emission region NPXA-R enclosing the firstemission region PXA-R.

The first adhesive film AF1 and the anti-reflection unit RPP may bedisposed on the diffraction pattern layer DFL. The anti-reflection unitRPP may be coupled to the diffraction pattern layer DFL by the firstadhesive film AF1. The first adhesive film AF1 may be formed to fill theholes DFP-R. However, exemplary embodiments are not limited thereto. Inan exemplary embodiment, the air layer may be formed in the holes DFP-R.

In an exemplary embodiment, a cover layer may be further disposedbetween the diffraction pattern layer DFL and the first adhesive filmAF1. The cover layer may be formed of or include an organic material oran inorganic material. Here, the organic material may include at leastone of acrylic resins, methacryl resins, polyisoprene resins, vinylresins, epoxy resins, urethane resins, cellulose resins, siloxaneresins, polyimide resins, polyamide resins, and perylene resins. Also,the inorganic material may include at least one of aluminum oxide,titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, andhafnium oxide.

Referring to FIG. 22 , the diffraction pattern layer DFL may be disposedbetween the display panel DP and the input-sensing unit ISP3. In anexemplary embodiment, the diffraction pattern layer DFL may be directlydisposed on the display panel DP. For example, the diffraction patternlayer DFL may be directly disposed on the encapsulation layer TFE of thedisplay panel DP. In this case, the second inorganic encapsulation layerT-IL2, which is the topmost layer of the encapsulation layer TFE, may bepartially exposed by the holes DFP-R. In this case, the first insulatinglayer IL1 of the input-sensing unit ISP3 may be formed to fill the holesDFP-R.

Referring to FIGS. 21 and 23 , the diffraction pattern layer DFL mayinclude the red diffraction patterns DFP-R, which are disposed tocorrespond to the first pixel PX-R of the first to third pixels PX-R,PX-G, and PX-B, and the blue diffraction patterns DFP-B, which aredisposed to correspond to the third pixel PX-B.

In the display module DM of FIG. 21 , the diffraction pattern layer DFLmay have the substantially same structure as the display module DM(i.e., the diffraction pattern layer DFL) of FIG. 20 , except for theblue diffraction patterns DFP-B that are additionally provided.

In the display module DM of FIG. 23 , the diffraction pattern layer DFLmay have the substantially same structure as the display module DM(i.e., the diffraction pattern layer DFL) of FIG. 22 , except for theblue diffraction patterns DFP-B that are additionally provided. Althoughcertain exemplary embodiments and implementations have been describedherein, other embodiments and modifications will be apparent from thisdescription. Accordingly, the inventive concepts are not limited to suchembodiments, but rather to the broader scope of the appended claims andvarious obvious modifications and equivalent arrangements as would beapparent to a person of ordinary skill in the art.

What is claimed is:
 1. A display device comprising: a display panelincluding a light-emitting device to emit light; and an input sensordisposed over the display panel, wherein the input sensor comprises: afirst insulating layer disposed over the display panel; a secondinsulating layer disposed on the first insulating layer; and a pluralityof diffraction patterns disposed in at least one of the first and secondinsulating layers, wherein the display panel comprises a plurality ofpixels and an encapsulation layer covering the plurality of pixels, andwherein the first insulating layer is directly disposed on theencapsulation layer, and the plurality of diffraction patterns overlapat least one of the plurality of pixels.
 2. The display device of claim1, wherein the plurality of diffraction patterns are disposed in thesecond insulating layer.
 3. The display device of claim 1, wherein theplurality of diffraction patterns are disposed in the first insulatinglayer.
 4. The display device of claim 1, wherein the plurality ofdiffraction patterns comprise: a plurality of first diffraction patternsdisposed in the first insulating layer; and a plurality of seconddiffraction patterns disposed in the second insulating layer.
 5. Thedisplay device of claim 4, wherein the first insulating layer has amulti-layered structure including at least two stacked sub-insulatinglayers.
 6. The display device of claim 5, wherein the plurality of firstdiffraction patterns comprise: a plurality of first sub-diffractionpatterns disposed in a first sub-insulating layer of the firstinsulating layer; and a plurality of second sub-diffraction patternsdisposed in a second sub-insulating layer of the first insulating layerand overlapping the plurality of first sub-diffraction patterns, whereinthe plurality of second diffraction patterns are disposed in the secondinsulating layer overlapping the plurality of second sub-diffractionpatterns.
 7. The display device of claim 1, wherein the encapsulationlayer comprises: a first encapsulation layer covering the plurality ofpixels; a second encapsulation layer disposed on the first encapsulationlayer; and a third encapsulation layer disposed on the secondencapsulation layer, wherein the first insulating layer is directlydisposed on the third encapsulation layer.
 8. The display device ofclaim 7, wherein: the first insulating layer has a multi-layeredstructure including at least two stacked sub-insulating layers, and theplurality of diffraction patterns comprise: a plurality of firstdiffraction patterns disposed in the at least two sub-insulating layers;and a plurality of second diffraction patterns disposed in the secondinsulating layer.
 9. The display device of claim 8, wherein theplurality of diffraction patterns further comprise a plurality of thirddiffraction patterns disposed in the third encapsulation layeroverlapping the plurality of first diffraction patterns.
 10. The displaydevice of claim 1, wherein the plurality of diffraction patternscomprise a plurality of holes penetrating the at least one of the firstand second insulating layers.
 11. The display device of claim 1,wherein: the plurality of pixels includes: a first pixel to emit a firstlight; a second pixel to emit a second light having a wavelengthdifferent from a wavelength of the first light; and a third pixel toemit a third light having a wavelength different from the wavelength ofthe first light and the wavelength of the second light, and theplurality of diffraction patterns overlap at least one of the first tothird pixels.
 12. The display device of claim 11, wherein the pluralityof diffraction patterns overlap the first pixel.
 13. The display deviceof claim 11, wherein the plurality of diffraction patterns overlap thefirst and third pixels.
 14. A display device comprising: a display panelcomprising a plurality of pixels and an encapsulation layer covering theplurality of pixels, each of the plurality of pixels including alight-emitting device to emit light; a diffraction pattern layerincluding a plurality of diffraction patterns arranged on the displaypanel to diffract at least a portion of the light provided from thedisplay panel; and an input sensor disposed on the diffraction patternlayer, wherein the plurality of diffraction patterns are hole patternspenetrating the diffraction pattern layer and overlap at least one ofthe plurality of pixels, and wherein the diffraction pattern layer isdirectly disposed on the encapsulation layer.
 15. The display device ofclaim 14, wherein: the plurality of pixels comprise a first pixel toemit a first light, a second pixel to emit a second light, and a thirdpixel to emit a third light, and the plurality of diffraction patternsoverlap at least one of the first to third pixels.
 16. The displaydevice of claim 15, wherein the plurality of diffraction patternsoverlap the first pixel.
 17. The display device of claim 15, wherein theplurality of diffraction patterns overlap the first and third pixels.18. The display device of claim 14, wherein the encapsulation layercomprises: a first encapsulation layer covering the plurality of pixels;a second encapsulation layer disposed on the first encapsulation layer;and a third encapsulation layer disposed on the second encapsulationlayer, wherein the diffraction pattern layer is directly disposed on thethird encapsulation layer.
 19. The display device of claim 14, whereinthe input sensor comprises: a first insulating layer disposed on thediffraction pattern layer; and a second insulating layer disposed on thefirst insulating layer, the diffraction pattern layer is disposedbetween the first insulating layer and the encapsulation layer.
 20. Thedisplay device of claim 19, wherein the first insulating layer isdirectly disposed on the diffraction pattern layer.